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    Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
    1.
    发明授权
    Multi-layer circuit substrates and electrical assemblies having conductive composition connectors 有权
    具有导电组合物连接器的多层电路基板和电气组件

    公开(公告)号：US6054761A

    公开(公告)日：2000-04-25

    申请号：US203126

    申请日：1998-12-01

    申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

    发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

    IPC分类号： C08K3/00 ,  C08L63/00 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L23/04

    CPC分类号： H05K3/363 ,  H01L23/49883 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H01L2224/16503 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/4623

    摘要： Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25.degree. C.

    摘要翻译： 公开了印刷电路基板和包括导电组合物的电气组件。 印刷电路基板和电组件实施例包括第一导电区域和第二导电区域。 电介质层设置在第一和第二导电区域之间。 在电介质层中设置孔，并且包括导电组合物的通孔结构设置在孔中。 导电组合物优选处于固化状态并与第一和第二导电区域电连通。 在优选的实施方案中，导电组合物包含至少约75wt。 基于组合物的重量％。 至少50重量％的导电颗粒具有小于约400℃的熔点。该组合物还包括载体，其包含至少约50重量％的量的环氧官能树脂。 基于载体的重量，以及基于载体重量的至少约0.1重量％的助熔剂。 环氧官能树脂在25℃下的粘度可以小于约1000厘泊