发明授权
- 专利标题： Semiconductor device having lead terminals bent in J-shape
- 专利标题（中）： 具有弯曲成J形的引线端子的半导体器件
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申请号： US09417745申请日： 1999-10-14
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公开(公告)号： US06319753B1公开(公告)日： 2001-11-20
- 发明人: Seiji Ichikawa , Takeshi Umemoto , Toshiaki Nishibe , Kazunari Sato , Kunihiko Tsubota , Masato Suga , Yoshikazu Nishimura , Keita Okahira , Tatsuya Miya , Toru Kitakoga , Kazuhiro Tahara
- 申请人： Seiji Ichikawa , Takeshi Umemoto , Toshiaki Nishibe , Kazunari Sato , Kunihiko Tsubota , Masato Suga , Yoshikazu Nishimura , Keita Okahira , Tatsuya Miya , Toru Kitakoga , Kazuhiro Tahara
- 优先权： JP9-129671 19970520
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin member and free ends of outer portions of the lead terminals are positioned in the recess of the radiating plate. The free ends of the outer portions of the lead terminals and the recess of the radiating plate are isolated from each other by projections of the resin member. Since the radiating plate is exposed to the lower face of the resin member, the heat radiating property is high whereas the radiating plate and the lead terminals are not short-circuited to each other at all.
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