发明授权
- 专利标题: Epoxy resin composition and semiconductor device
- 专利标题(中): 环氧树脂组合物和半导体器件
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申请号: US09640874申请日: 2000-08-18
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公开(公告)号: US06342309B1公开(公告)日: 2002-01-29
- 发明人: Toshio Shiobara , Shigeki Ino , Yasuo Kimura , Takayuki Aoki , Kazuhiro Arai , Hidenori Mizushima
- 申请人: Toshio Shiobara , Shigeki Ino , Yasuo Kimura , Takayuki Aoki , Kazuhiro Arai , Hidenori Mizushima
- 优先权: JP11-232199 19990819
- 主分类号: H01L2912
- IPC分类号: H01L2912
摘要:
An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.