发明授权
- 专利标题： Low melting point glass, insulating package, and sealing member
- 专利标题（中）： 低熔点玻璃，绝缘包装和密封件
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申请号： US09571664申请日： 2000-05-15
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公开(公告)号： US06344424B1公开(公告)日： 2002-02-05
- 发明人: Yoshihiro Goto , Eigo Kishi , Katuya Terai , Yoshinobu Natsuhara
- 申请人： Yoshihiro Goto , Eigo Kishi , Katuya Terai , Yoshinobu Natsuhara
- 优先权： JP11-133959 19990514; JP11-146043 19990526; JP11-148975 19990528; JP11-339835 19991130
- 主分类号： C03C818
- IPC分类号： C03C818
摘要：
An insulating package is provided with an insulating base having a bottom plate and frame body, electrodes led from the inside to the outside of the insulating base, and a metal cap to seal the frame body. The metal cap is adhered to the frame body by low melting point glass. This low melting point glass contains at least one selected from a group consisting of Al, Ni, Ag, BaTiO3, NiCr, TiB, and TiO2, and inside the glass, spherical particles with diameters of 10 &mgr;m or more are dispersed.