发明授权
US06351516B1 Detection of voids in semiconductor wafer processing 有权
检测半导体晶片加工中的空隙

  • 专利标题: Detection of voids in semiconductor wafer processing
  • 专利标题(中): 检测半导体晶片加工中的空隙
  • 申请号: US09461670
    申请日: 1999-12-14
  • 公开(公告)号: US06351516B1
    公开(公告)日: 2002-02-26
  • 发明人: Isaac MazorLong Vu
  • 申请人: Isaac MazorLong Vu
  • 主分类号: G01N23223
  • IPC分类号: G01N23223
Detection of voids in semiconductor wafer processing
摘要:
A method for testing the deposition and/or the removal of a material within a recess on the surface of a sample. An excitation beam is directed onto a region of the sample in a vicinity of the recess, and an intensity of X-ray fluorescence, emitted from the region in a spectral range in which the material is known to fluoresce, is measured. A quantity of the material that is deposited within the recess is determined responsive to the measured intensity.
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