发明授权
- 专利标题： Semiconductor module
- 专利标题（中）： 半导体模块
-
申请号： US09603966申请日： 2000-06-26
-
公开(公告)号： US06353258B1公开(公告)日： 2002-03-05
- 发明人: Hirokazu Inoue , Ryuichi Saito , Mutsuhiro Mori , Yasutoshi Kurihara , Jin Onuki , Shin Kimura , Satoshi Shimada , Kazuhiro Suzuki , Yukio Kamita , Isao Kobayashi , Kazuji Yamada , Naohiro Momma
- 申请人： Hirokazu Inoue , Ryuichi Saito , Mutsuhiro Mori , Yasutoshi Kurihara , Jin Onuki , Shin Kimura , Satoshi Shimada , Kazuhiro Suzuki , Yukio Kamita , Isao Kobayashi , Kazuji Yamada , Naohiro Momma
- 优先权： JP7-4669 19950117
- 主分类号： H01L2334
- IPC分类号： H01L2334
摘要：
A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.