发明授权
- 专利标题： Soldering member for printed wiring boards
- 专利标题（中）： 印刷线路板焊接件
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申请号： US09424582申请日： 1999-11-26
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公开(公告)号： US06358630B1公开(公告)日： 2002-03-19
- 发明人: Kiyotaka Tsukada , Hiroyuki Kobayashi , Yoshikazu Ukai , Kenji Chihara , Yoshihide Tohyama , Yasuyoshi Okuda , Yoshihiro Kodera
- 申请人： Kiyotaka Tsukada , Hiroyuki Kobayashi , Yoshikazu Ukai , Kenji Chihara , Yoshihide Tohyama , Yasuyoshi Okuda , Yoshihiro Kodera
- 优先权： JP9-163337 19970604; JP9-205314 19970714; JP9-279805 19970925; JP9-279806 19970925; JP9-279807 19970925; JP9-279642 19970926; JP9-279643 19970926; JP9-279644 19970926
- 主分类号： B32B1501
- IPC分类号： B32B1501
摘要：
This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.