公开(公告)号：US06358630B1

公开(公告)日：2002-03-19

申请号：US09424582

申请日：1999-11-26

Applicant: Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Yoshikazu Ukai ,  Kenji Chihara ,  Yoshihide Tohyama ,  Yasuyoshi Okuda ,  Yoshihiro Kodera

Inventor： Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Yoshikazu Ukai ,  Kenji Chihara ,  Yoshihide Tohyama ,  Yasuyoshi Okuda ,  Yoshihiro Kodera

IPC: B32B1501

CPC classification number: H05K3/244 ,  B23K35/007 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T428/12028 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12944 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Abstract translation: 本发明涉及一种用于外部连接的焊料构件，其与形成在与导体图案相对应的印刷电路板的表面上的连接端子接合，并且具有无电镀Ni / Au镀层，其中，焊料构件是含有 细铜粉，对连接端子具有优异的接合强度。