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发明授权
US06369985B1 Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension 失效
头部悬挂，头部组件和具有安装在头部悬挂上的头部IC的盘装置，以及用于将头部IC装配到头部悬架的方法

  • 专利标题： Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension
  • 专利标题（中）： 头部悬挂，头部组件和具有安装在头部悬挂上的头部IC的盘装置，以及用于将头部IC装配到头部悬架的方法
  • 申请号： US09507816
    申请日： 2000-02-22
  • 公开(公告)号： US06369985B1
    公开(公告)日： 2002-04-09
  • 发明人: Akio Gouo , Hidehiko Kira , Norio Kainuma , Takeshi Ohwe
  • 申请人： Akio Gouo , Hidehiko Kira , Norio Kainuma , Takeshi Ohwe
  • 优先权： JP11-201193 19990715
  • 主分类号： G11B548
  • IPC分类号： G11B548
Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension
摘要：
A head slider and head IC are mounted on a head suspension, the head IC being mounted on a head IC mounting surface. One or more through holes are provided on the head IC mounting surface of the head suspension and the head IC is mounted by injecting a bonding agent between the mounting surface and the head IC through the through holes. The bonding agent is evenly distributed beneath the head IC, so that the head suspension is well balanced.
摘要（中）：

头部滑块和头部IC安装在头部悬挂上，头部IC安装在头部IC安装表面上。 一个或多个通孔设置在头悬架的头部IC安装表面上，并且通过通孔在安装表面和头部IC之间注入粘合剂来安装头部IC。 粘合剂均匀地分布在头部IC下面，使得头部悬挂体系平衡良好。

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