发明授权
- 专利标题： Semiconductor device, manufacturing method thereof and mounting board
- 专利标题（中）： 半导体装置及其制造方法以及安装板
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申请号： US09077190申请日： 1998-05-26
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公开(公告)号： US06404049B1公开(公告)日： 2002-06-11
- 发明人: Masanori Shibamoto , Masahiro Ichitani , Ryo Haruta , Katsuyuki Matsumoto , Junichi Arita , Ichiro Anjo
- 申请人： Masanori Shibamoto , Masahiro Ichitani , Ryo Haruta , Katsuyuki Matsumoto , Junichi Arita , Ichiro Anjo
- 优先权： JP7-308761 19951128
- 主分类号： H01L2334
- IPC分类号： H01L2334
摘要：
A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.
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