A package structure stacking chips on a front surface and a back surface of a substrate including at least a substrate, a plurality of chip sets, a plurality of support members, a plurality of glue layers, a plurality of wires, and a mold compound. The substrate has a front surface and a back surface opposite to the front surface. Each chip set has one or more chips, each chip having a plurality of bonding pads. The chip sets are stacked as a laminate on the front surface of the substrate, respectively. A plurality of support members are arranged between each two adjacent chip sets. A glue layers are used to connect the support members, the chip sets, and the substrate. The chip in the same chip sets is electrically connected to each other or to the substrate by the bonding pads. Finally, the front surface of the substrate, the support members, the chip sets, and the glue layers are encapsulated with a mold compound. Moreover, a plurality of flip chips are deposited on the back surface of the substrate.