公开(公告)号：US06555902B2

公开(公告)日：2003-04-29

申请号：US09895553

申请日：2001-06-28

申请人： Randy H. Y. Lo ,  Chien-Ping Huang ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chien-Ping Huang ,  Chi-Chuan Wu

IPC分类号： H01L2302

CPC分类号： H01L25/0652 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00

摘要： A packaging structure comprises a substrate, a plurality of semiconductor chips contiguously mounted into a plurality of stacked semiconductor chip sets, a plurality of supporting members, a plurality of adhesive layers, a plurality of wires and a molding compound. Each of the semiconductor chip sets comprises at least a semiconductor chip, each semiconductor chip having plurality of bonding pads. The size deviation between the semiconductor chip sets is less than 0.3 mm. The supporting members separate from one another the semiconductor chip sets stacked above the substrate. The adhesive layers bond the substrate, the supporting members and the semiconductor chips to one another. The wires connect the semiconductor chips to one another and to the substrate. The molding compound encapsulates the substrate, the semiconductor chips, the supporting members, and the adhesive layers.

公开(公告)号：US06593662B1

公开(公告)日：2003-07-15

申请号：US09631343

申请日：2000-08-02

申请人： Han-Ping Pu ,  Randy H. Y. Lo ,  Tzong-Dar Her ,  Chien-Ping Huang ,  Cheng-Shiu Hsiao ,  Chi-Chuan Wu

发明人： Han-Ping Pu ,  Randy H. Y. Lo ,  Tzong-Dar Her ,  Chien-Ping Huang ,  Cheng-Shiu Hsiao ,  Chi-Chuan Wu

IPC分类号： H01L2348

CPC分类号： H01L24/33 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A stacked-die package structure comprises a carrier, dies, spacers, adhesive layers, conductive lines, a mold compound, and solder balls. The carrier has an upper surface and a back surface opposite to the upper surface. The dies substantially having the same sizes are stacked one by one on the upper surface of the carrier, and a number of bonding pads are located around each die. The spacers are located between two adjacent dies. Adhesive layers located between the spacers, the dies, and the carrier for adhering layers therebetween. The conducting lines are respectively electrically connected between each of the bonding pads of the dies and the carrier. And the mold compound is formed over the upper surface of the carrier, for encapsulating the spacers, the dies and the adhesive layers. A substrate with solder balls or a lead frame having pins is suitable for serving as the carrier.

摘要翻译： 堆叠管芯封装结构包括载体，管芯，间隔物，粘合剂层，导电线，模具化合物和焊球。 载体具有与上表面相对的上表面和后表面。 基本上具有相同尺寸的模具在载体的上表面上一个接一个堆叠，并且多个焊盘位于每个管芯周围。 间隔件位于两个相邻的模具之间。 位于间隔件，模具和载体之间的粘合层，用于在其间粘合层。 导体线分别电连接在管芯和载体的每个接合焊盘之间。 并且模制化合物形成在载体的上表面上，用于封装间隔物，模具和粘合剂层。 具有焊球或具有引脚的引线框架的基板适合用作载体。

公开(公告)号：US06414384B1

公开(公告)日：2002-07-02

申请号：US09746793

申请日：2000-12-22

申请人： Randy H. Y. Lo ,  Chien-Ping Huang ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chien-Ping Huang ,  Chi-Chuan Wu

IPC分类号： H01L2302

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package structure stacking chips on a front surface and a back surface of a substrate including at least a substrate, a plurality of chip sets, a plurality of support members, a plurality of glue layers, a plurality of wires, and a mold compound. The substrate has a front surface and a back surface opposite to the front surface. Each chip set has one or more chips, each chip having a plurality of bonding pads. The chip sets are stacked as a laminate on the front surface of the substrate, respectively. A plurality of support members are arranged between each two adjacent chip sets. A glue layers are used to connect the support members, the chip sets, and the substrate. The chip in the same chip sets is electrically connected to each other or to the substrate by the bonding pads. Finally, the front surface of the substrate, the support members, the chip sets, and the glue layers are encapsulated with a mold compound. Moreover, a plurality of flip chips are deposited on the back surface of the substrate.

摘要翻译： 一种封装结构，其在至少包括基板，多个芯片组，多个支撑部件，多个胶合层，多个导线和模具化合物的基板的前表面和背面上堆叠芯片。 基板具有与前表面相对的前表面和后表面。 每个芯片组具有一个或多个芯片，每个芯片具有多个焊盘。 芯片组分别作为层叠体堆叠在基板的前表面上。 在每个两个相邻的芯片组之间布置有多个支撑构件。 使用胶层来连接支撑部件，芯片组和基板。 相同芯片组中的芯片通过焊盘彼此电连接或与基板电连接。 最后，用模具化合物包封衬底的前表面，支撑构件，芯片组和胶层。 此外，在基板的背面上沉积多个倒装芯片。

公开(公告)号：US06507120B2

公开(公告)日：2003-01-14

申请号：US09746819

申请日：2000-12-22

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu

IPC分类号： H01L2348

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A flip chip type quad flat non-leaded package, comprising: a plurality of leads each having a first surface and a second surface opposite to the first surface; a die having an active surface and a backside opposite the active surface, wherein the active surface has a plurality of bonding pads, each having a bump, and wherein each bump is connected to a first surface of one of the leads respectively; and a molding compound encapsulating the leads and the die, exposing second surfaces of the leads.

公开(公告)号：US06949413B2

公开(公告)日：2005-09-27

申请号：US10389138

申请日：2003-03-13

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed method utilizes a single substrate predefined with a plurality of package sites, and further utilizes a heat-spreader frame including an integrally-formed matrix of heat spreaders each corresponding to one of the package sites on the substrate. A batch of semiconductor chips are then mounted on the respective package sites on the substrate. During the encapsulation process, a single continuous encapsulation body is formed to encapsulate the entire heat-spreader frame and all the semiconductor chips. After ball implantation, a singulation process is performed to cut apart the encapsulation body into individual package units, each serving as the intended TFBGA package. In the foregoing process, since the entirety of the heat-spreader frame is relatively large in size as compared to the size of an individual TFBGA package, it can be easily handled, so that the embedding of a heat spreader in each package unit can be easily carried out.

公开(公告)号：US06507098B1

公开(公告)日：2003-01-14

申请号：US09417409

申请日：1999-10-13

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu

IPC分类号： H01L2302

CPC分类号： H01L25/0652 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/1515 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A multi-chip packaging structure in which a plurality of chips is aligned on two surfaces of a substrate and the substrate has an opening. The chip located on the second surface of the substrate has center bonding pads arrangement. These bonding pads are connected to the conductive connections on the first surface of the substrate by means of the opening. The other chips are attached to the first surface of the substrate and have a plurality of bonding pads connected to the conductive connections on the first surface of the substrate by wire bonding or flip-chip bonding. Furthermore, a heat sink is attached to the back surface of the chip located on the second surface in order to improve the heat dissipation performance of the package.

摘要翻译： 一种多芯片封装结构，其中多个芯片对准在基板的两个表面上，并且该基板具有开口。 位于基板的第二表面上的芯片具有中心焊盘布置。 这些接合焊盘通过开口连接到衬底的第一表面上的导电连接。 其它芯片附接到基板的第一表面，并且具有通过引线接合或倒装芯片接合连接到基板的第一表面上的导电连接的多个焊盘。 此外，为了提高封装的散热性能，将散热器安装在位于第二表面上的芯片的背面。

公开(公告)号：US06281578B1

公开(公告)日：2001-08-28

申请号：US09638989

申请日：2000-08-15

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu ,  Han-Ping Pu ,  Eric Ko

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu ,  Han-Ping Pu ,  Eric Ko

IPC分类号： H01L2334

CPC分类号： H01L23/49531 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A multi-chip module (MCM) integrated circuit package structure is proposed, which can be used to pack a plurality of semiconductor chips of different functions while nonetheless allowing the overall package size to be as small as some existing types of integrated circuit packages, such as the SO (Small Outline) and QFP (Quad Flat Package) types, so that it can be manufactured using the existing fabrication equipment. The proposed MCM integrated circuit package structure is characterized in the use of a substrate having a centrally-located opening, and at least one semiconductor chip is mounted on the front surface of the substrate and a semiconductor chip of a central-pad type having a plurality of centrally-located bonding pads is mounted on the back surface of the substrate with the centrally-located bonding pads being exposed through the opening. This arrangement allows the overall package size to be made very compact and also allows the wiring to the central-pad type semiconductor chip to be shortened.

摘要翻译： 提出了一种多芯片模块（MCM）集成电路封装结构，可用于封装多个不同功能的半导体芯片，同时允许整体封装尺寸与现有类型的集成电路封装一样小，如 作为SO（小外形）和QFP（四方扁平封装）类型，因此可以使用现有的制造设备制造。 所提出的MCM集成电路封装结构的特征在于使用具有居中定位的开口的衬底，并且至少一个半导体芯片安装在衬底的前表面上，以及具有多个中心焊盘的半导体芯片 中心定位的焊盘安装在基板的背面，中心位置的焊盘通过开口露出。 这种布置使得整体封装尺寸变得非常紧凑，并且还允许缩短到中心焊盘型半导体芯片的布线。

公开(公告)号：US06951776B2

公开(公告)日：2005-10-04

申请号：US10389657

申请日：2003-03-13

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L21/76

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed method utilizes a single substrate predefined with a plurality of package sites, and further utilizes a heat-spreader frame including an integrally-formed matrix of heat spreaders each corresponding to one of the package sites on the substrate. A batch of semiconductor chips are then mounted on the respective package sites on the substrate. During the encapsulation process, a single continuous encapsulation body is formed to encapsulate the entire heat-spreader frame and all the semiconductor chips. After ball implantation, a singulation process is performed to cut apart the encapsulation body into individual package units, each serving as the intended TFBGA package. In the foregoing process, since the entirety of the heat-spreader frame is relatively large in size as compared to the size of an individual TFBGA package, it can be easily handled, so that the embedding of a heat spreader in each package unit can be easily carried out.

摘要翻译： 提出了一种制造具有嵌入式散热器的TFBGA（Thin＆Fine Ball-Grid Array）薄膜封装的方法。 通常，由于单独的TFBGA封装的尺寸相当小，所以在其中并入嵌入式散热器是非常困难的。 作为解决这一问题的方案，所提出的方法利用预定义的多个封装位置的单个衬底，并且进一步利用散热器框架，该散热器框架包括整体形成的散热器矩阵，每个对应于衬底上的一个封装位置 。 然后将一批半导体芯片安装在基板上的相应封装位置上。 在封装过程中，形成一个单一的连续封装体以封装整个散热器框架和所有半导体芯片。 在球注入之后，进行单独处理以将封装体切割成单独的封装单元，每个封装单元用作预期的TFBGA封装。 在上述过程中，由于与单独的TFBGA封装的尺寸相比，散热器框架的整体尺寸相对较大，所以可以容易地处理散热器框架，使得散热器在每个封装单元中的嵌入可以是 容易进行

公开(公告)号：US06949414B2

公开(公告)日：2005-09-27

申请号：US10389166

申请日：2003-03-13

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed method utilizes a single substrate predefined with a plurality of package sites, and further utilizes a heat-spreader frame including an integrally-formed matrix of heat spreaders each corresponding to one of the package sites on the substrate. A batch of semiconductor chips are then mounted on the respective package sites on the substrate. During the encapsulation process, a single continuous encapsulation body is formed to encapsulate the entire heat-spreader frame and all the semiconductor chips. After ball implantation, a singulation process is performed to cut apart the encapsulation body into individual package units, each serving as the intended TFBGA package. In the foregoing process, since the entirety of the heat-spreader frame is relatively large in size as compared to the size of an individual TFBGA package, it can be easily handled, so that the embedding of a heat spreader in each package unit can be easily carried out.

公开(公告)号：US06541310B1

公开(公告)日：2003-04-01

申请号：US09624093

申请日：2000-07-24

申请人： Randy H. Y. Lo ,  Chi-Chuan Wu

发明人： Randy H. Y. Lo ,  Chi-Chuan Wu

IPC分类号： H01L2144

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed method utilizes a single substrate pre-defined with a plurality of package sites, and further utilizes a heat-spreader frame including an integrally-formed matrix of heat spreaders each corresponding to one of the package sites on the substrate. A batch of semiconductor chips are then mounted on the respective package sites on the substrate. During the encapsulation process, a single continuous encapsulation body is formed to encapsulate the entire heat-spreader frame and all the semi-conductor chips. After ball implantation, a singulation process is performed to cut apart the encapsulation body into individual package units, each serving as the intended TFBGA package. In the foregoing process, since the entirety of the heat-spreader frame is relatively large in size as compared to the size of an individual TFBGA package, it can be easily handled, so that the embedding of a heat spreader in each package unit can be easily carried out.

摘要翻译： 提出了一种制造具有嵌入式散热器的TFBGA（Thin＆Fine Ball-Grid Array）薄膜封装的方法。 通常，由于单独的TFBGA封装的尺寸相当小，所以在其中并入嵌入式散热器是非常困难的。 作为解决这个问题的方案，所提出的方法利用预定义为多个封装位置的单个衬底，并且进一步利用散热器框架，该散热器框架包括整体形成的散热器矩阵，每个对应于一个封装位置 底物。 然后将一批半导体芯片安装在基板上的相应封装位置上。 在封装过程中，形成一个单一的连续封装体，以封装整个散热器框架和所有半导体芯片。 在球注入之后，进行单独处理以将封装体切割成单独的封装单元，每个封装单元用作预期的TFBGA封装。 在上述过程中，由于与单独的TFBGA封装的尺寸相比，散热器框架的整体尺寸相对较大，所以可以容易地处理散热器框架，使得散热器在每个封装单元中的嵌入可以是 容易进行