发明授权
- 专利标题： Multilayer capacitance structure and circuit board containing the same and method of forming the same
- 专利标题（中）： 多层电容结构和电路板含有相同的方法和其形成方法
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申请号： US10026873申请日： 2001-12-21
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公开(公告)号： US06496356B2公开(公告)日： 2002-12-17
- 发明人: Robert M. Japp , John M. Lauffer , Konstantinos I. Papathomas
- 申请人： Robert M. Japp , John M. Lauffer , Konstantinos I. Papathomas
- 主分类号： H01G4228
- IPC分类号： H01G4228
摘要：
A method of forming a capacitive core structure and of forming a circuitized printed wiring board from the core structure and the resulting structures are provided. The capacitive core structure is formed by providing a central conducting plane of a sheet of conductive material and forming at least one clearance hole in the central conducting plane. First and second external conducting planes are laminated to opposite sides of the ground plane with a film of dielectric material between each of the first and second external planes and the central conducting plane. At least one clearance hole is formed in each of the first and second external planes. A circuitized wiring board structure can be formed by laminating a capacitive core structure between two circuitized structures. The invention also relates to the structures formed by these methods.