Invention Grant
- Patent Title: Semiconductor encapsulating epoxy resin composition and semiconductor device
- Patent Title (中): 半导体封装环氧树脂组合物和半导体器件
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Application No.: US09641817Application Date: 2000-08-18
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Publication No.: US06500564B1Publication Date: 2002-12-31
- Inventor: Toshio Shiobara , Kazuhiro Arai , Hidenori Mizushima , Shigeki Ino , Yasuo Kimura , Takayuki Aoki
- Applicant: Toshio Shiobara , Kazuhiro Arai , Hidenori Mizushima , Shigeki Ino , Yasuo Kimura , Takayuki Aoki
- Priority: JP11-232198 19990819
- Main IPC: H01L2912
- IPC: H01L2912
Abstract:
An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.
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