发明授权
- 专利标题： Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题（中）： 半导体封装环氧树脂组合物和半导体器件
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申请号： US09641817申请日： 2000-08-18
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公开(公告)号： US06500564B1公开(公告)日： 2002-12-31
- 发明人: Toshio Shiobara , Kazuhiro Arai , Hidenori Mizushima , Shigeki Ino , Yasuo Kimura , Takayuki Aoki
- 申请人： Toshio Shiobara , Kazuhiro Arai , Hidenori Mizushima , Shigeki Ino , Yasuo Kimura , Takayuki Aoki
- 优先权： JP11-232198 19990819
- 主分类号： H01L2912
- IPC分类号： H01L2912
摘要：
An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.