发明授权
- 专利标题： Apparatus for manufacturing a wiring substrate
- 专利标题（中）： 用于制造布线基板的装置
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申请号： US09093605申请日： 1998-06-09
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公开(公告)号： US06507995B1公开(公告)日： 2003-01-21
- 发明人: Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
- 申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
- 优先权： JP9-155462 19970612
- 主分类号： B23P1900
- IPC分类号： B23P1900
摘要：
The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
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