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    Semiconductor package and printed wiring board for semiconductor package
    1.
    发明授权
    Semiconductor package and printed wiring board for semiconductor package 失效
    用于半导体封装的半导体封装和印刷电路板

    公开(公告)号：US06534873B1

    公开(公告)日：2003-03-18

    申请号：US09655785

    申请日：2000-09-06

    申请人： Yoshizumi Sato ,  Kenji Sasaoka

    发明人： Yoshizumi Sato ,  Kenji Sasaoka

    IPC分类号： H01L2348

    CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： A ground pattern (12) and power supply pattern (13) which are formed on the surface of a printed wiring board (10) are connected to a ground layer (21) and power supply layer (22) formed as the internal layers via bumps (24a, 24b). The ground pattern (12) need not be connected to the ground layer (21) by uniformly plating the inner side surface of a cavity (43), contributing to an increase in yield and a decrease in cost. When a power supply pattern (13) is to be connected to a power supply layer (22) using through holes, the power supply pattern (13) must be spaced apart from signal pins (14) detouring the region where the through holes are to be formed. However, the distance between the power supply pattern and the signal pins can.be reduced by using bumps. The distance between a semiconductor chip (41) and the signal pins (14) can be reduced to improve the electrical characteristics.

    摘要翻译： 形成在印刷电路板（10）的表面上的接地图案（12）和电源图案（13）通过凸块连接到形成为内层的接地层（21）和电源层（22） （24a，24b）。 接地图案（12）不需要通过均匀地电镀空腔（43）的内侧表面而连接到接地层（21），有助于提高产量并降低成本。 当使用通孔将电源图案（13）连接到电源层（22）时，电源模式（13）必须与通孔所在区域的信号引脚（14）间隔开， 形成。 然而，通过使用凸块来减小电源图案和信号引脚之间的距离。 可以减小半导体芯片（41）和信号引脚（14）之间的距离，以改善电气特性。

    Method of manufacturing printed wiring boards
    8.
    发明授权
    Method of manufacturing printed wiring boards 失效
    制造印刷电路板的方法

    公开(公告)号：US5865934A

    公开(公告)日：1999-02-02

    申请号：US902100

    申请日：1997-07-29

    申请人： Yuichi Yamamoto ,  Yoshizumi Sato ,  Tomohisa Motomura ,  Hiroshi Hamano ,  Yasushi Arai

    发明人： Yuichi Yamamoto ,  Yoshizumi Sato ,  Tomohisa Motomura ,  Hiroshi Hamano ,  Yasushi Arai

    IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/10

    CPC分类号： H05K3/4658 ,  H05K1/115 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4647 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09645 ,  H05K2203/068 ,  H05K2203/1189 ,  H05K2203/1572 ,  H05K3/20 ,  H05K3/429 ,  H05K3/4652 ,  Y10T156/109 ,  Y10T29/49151 ,  Y10T29/49222

    摘要： There is provided a method for arranging conductive bumps at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet being is in a plastic state or up to a temperature not lower than the grass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough. This permits positive connections with a high accuracy without forming a through-hole.

    摘要翻译： 提供了一种在压制一体化阶段期间在穿过绝缘层的预定位置布置导电凸块的方法，以确保布线图案和导电金属之间的电和热导率以及布线图案之间的电连接。 更具体地，导电凸块的尖端经受塑性变形以形成布线图案之间或布线图案与导电金属之间的互连。 还提供了制造印刷线路板的方法。 合成树脂片被形成有导电凸块的表面夹在层叠体中。 将层压体加热直到合成树脂片的树脂成分处于塑性状态或达到不低于该树脂的草转变温度的温度。 此时，导电性凸块被压在合成树脂片上并穿过其中。 这样可以在不形成通孔的情况下高精度地进行正向连接。

    Method of producing a three-dimensional wiring board
    10.
    发明授权
    Method of producing a three-dimensional wiring board 失效
    三维布线板的制造方法

    公开(公告)号：US5333379A

    公开(公告)日：1994-08-02

    申请号：US863904

    申请日：1992-04-06

    申请人： Hiroshi Odaira ,  Yoshizumi Sato

    发明人： Hiroshi Odaira ,  Yoshizumi Sato

    IPC分类号： B29C33/14 ,  B29C44/18 ,  B29C45/14 ,  B29L31/34 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B29C67/22 ,  H05K3/30

    CPC分类号： H05K3/205 ,  B29C44/18 ,  H05K3/0014 ,  H05K2201/09118 ,  H05K2203/0726 ,  Y10T29/4913 ,  Y10T29/49146

    摘要： Small projections are arranged on a molding surface of at least one of an upper die half and a lower die half constituting a molding die, and a predetermined number of conductor circuits each including small projections are formed on the molding surface by electrically plating. A predetermined number of conductor circuits are formed on the molding surface of other die half in the same manner. Subsequently, the molding surfaces of both the die halves are brought in pressure contact with each other so that the electrically plated layers each including small projections on the molding surface are connected electrically. Thereafter, the hollow space between both the die halves is filled with a predetermined resin, whereby the conductor circuits are reversely secured to the resultant molded product to complete production of a three-dimensional wiring board. After electronic components are assembled on the three-dimensional wiring board, the resin is removed from the molded product by dissolving the resin. Consequently, a hollow three-dimensional wiring structure is formed. Thus, three-dimensional conductor circuits which are electrically connected to each other at predetermined positions are formed on the front and rear surfaces of molded product. Thus, the three-dimensional wiring board can be produced at a high efficiency without any necessity for complicated steps and actuation. An electronic circuit module produced by assembling electronic components on the three-dimensional wiring board assures that signals can be processed at a high speed.

    摘要翻译： 在构成成型模具的上模半模和下模半部中的至少一个的成形面上配置有小突起，通过电镀在成形面上形成规定数量的具有小突起的导体电路。 以相同的方式在其他半模的成型表面上形成预定数量的导体电路。 随后，两个半模的成型表面彼此压力接触，使得在成型表面上各包括小突起的电镀层电连接。 此后，两个半模之间的中空空间填充有预定的树脂，由此导体电路与所得模制产品反向固定，从而完成三维布线板的制造。 将电子元件组装在三维布线板上之后，树脂通过溶解树脂而从成形品中除去。 因此，形成中空的三维布线结构。 因此，在模制品的前表面和后表面上形成在预定位置彼此电连接的三维导体电路。 因此，可以高效率地制造三维接线板，而不需要复杂的步骤和致动。 通过在三维布线板上组装电子部件而制造的电子电路模块确保能够高速地处理信号。