- 专利标题： Wiring circuit board and method for producing same
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申请号： US10086428申请日： 2002-03-04
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公开(公告)号： US06512182B2公开(公告)日： 2003-01-28
- 发明人: Hiroki Takeuchi , Toshifumi Kojima , Kazushige Obayashi
- 申请人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Obayashi
- 优先权： JP2001-068133 20010312
- 主分类号： H05K103
- IPC分类号： H05K103
摘要：
The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.
公开/授权文献
- US20020185303A1 Wiring circuit board and method for producing same 公开/授权日：2002-12-12
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