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公开(公告)号：US06586827B2
公开(公告)日：2003-07-01
申请号：US10026928
申请日：2001-12-27
IPC分类号： H01L2322
CPC分类号： H05K1/185 , B32B15/08 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/15312 , H05K1/0231 , Y10T428/24917 , H01L2924/00 , H01L2224/05599
摘要： A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.
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公开(公告)号：US06876091B2
公开(公告)日：2005-04-05
申请号：US10024581
申请日：2001-12-21
IPC分类号： H05K3/28 , H01L23/498 , H05K1/18 , H05K3/46 , H01L23/29
CPC分类号： H01L23/49822 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16235 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , Y10T428/24802 , Y10T428/24926 , H01L2224/05599
摘要： The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan δ of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.
摘要翻译： 本发明提供了一种布线基板，其中电子部件通过嵌入树脂嵌入，该嵌入树脂在布线板中的电子部件的高安装密度，其表现出优异的电性能如绝缘性能，防止光的随机反射 并且其在固化期间降低树脂的颜色不均匀。 本发明包括一种布线板，其中使用具有小于或等于约5的介电常数和小于或等于约0.08的tanδ的嵌入树脂来嵌入电子部件。 嵌入树脂优选含有小于或等于约1.4质量％的量的炭黑。 此外，嵌入树脂优选至少含有热固性树脂和至少一种无机填料。
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公开(公告)号：US06512182B2
公开(公告)日：2003-01-28
申请号：US10086428
申请日：2002-03-04
IPC分类号： H05K103
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10636 , Y02P70/611 , Y10T29/49146 , Y10T29/49155 , Y10T428/24917 , Y10T428/249996 , H01L2924/00 , H01L2224/05599
摘要： The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.
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公开(公告)号：US06680123B2
公开(公告)日：2004-01-20
申请号：US10024601
申请日：2001-12-21
IPC分类号： B32B2738
CPC分类号： H01L21/568 , C08K3/04 , H01L21/563 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/3011 , H05K1/0231 , H05K1/185 , Y10T428/31511 , Y10T428/31515 , Y10T428/31529 , H01L2924/00 , H01L2224/05599
摘要： An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.
摘要翻译： 嵌入树脂将电子部件嵌入物体中，并且具有约5以下的介电常数和约0.08以下的tanδ。
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5.发明授权Embedding resin, wiring substrate using same and process for producing wiring substrate using same 有权嵌入树脂，使用其的布线基板和使用该布线基板的制造方法公开(公告)号：US06740411B2
公开(公告)日：2004-05-25
申请号：US10042317
申请日：2002-01-11
IPC分类号： B32B2738
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/3011 , H05K1/0231 , H05K1/185 , Y10S428/901 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , H01L2924/00012 , H01L2224/05599
摘要： An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.
摘要翻译： 用于将电子部件嵌入布线基板中的嵌入树脂包括可溶性树脂和可溶性有机填料中的至少一种作为可溶性成分，以与氧化剂一起溶解。
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公开(公告)号：US06770965B2
公开(公告)日：2004-08-03
申请号：US10026454
申请日：2001-12-27
IPC分类号： H05K346
CPC分类号： H01L21/568 , H01L21/563 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/0231 , H05K1/185 , Y10T428/24917 , H01L2924/00
摘要： A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.
摘要翻译： 布线基板包括（1）具有开口的绝缘基板或芯基板和堆积层，其中芯基板和堆积层中的至少一个具有开口，（2）至少一个电子部件 （3）包含热塑性树脂，酸酐固化剂，固化促进剂和填料的嵌入树脂，其中嵌入树脂在剪切速率下显示不高于85Pa.s的粘度 在25℃±1℃下静置24小时后为8.4s -1。
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公开(公告)号：US06822170B2
公开(公告)日：2004-11-23
申请号：US10025764
申请日：2001-12-26
IPC分类号： H05K100
CPC分类号： H01L21/568 , H01L21/563 , H01L21/6835 , H01L23/498 , H01L23/49816 , H01L23/564 , H01L23/642 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/0231 , H05K1/185 , H05K3/4602 , Y10S428/901 , Y10T428/31678 , Y10T428/31714 , H01L2924/00 , H01L2224/05599
摘要： In an embedding resin for embedding electronic parts, after a substrate in which a copper layer is formed on a cured product of the embedding resin is subjected to a pressure cooker test, the copper layer has a peeling strength of at least 588 N/m (0.6 kg/cm), wherein the conditions of the pressure cooker test are 121° C., 100% by mass humidity, 2.1 atm and 168 hours, and the measurement method of the peeling strength is according to JIS C 5012, and the width of the copper layer is 10 mm.
摘要翻译： 在用于嵌入电子部件的嵌入树脂中，在对嵌入树脂的固化物形成了铜层的基板进行压力锅试验后，铜层的剥离强度为588N / m（ 0.6kg / cm 2），其中压力锅试验条件为121℃，100质量％湿度，2.1atm和168小时，剥离强度的测定方法为JIS C 5012，宽度 的铜层为10mm。
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公开(公告)号：US20050105860A1
公开(公告)日：2005-05-19
申请号：US10782870
申请日：2004-02-23
申请人： Takeshi Oono , Toshikatsu Takada , Mitsugu Onoda , Toshifumi Kojima , Toshikazu Horio , Ayako Kawamura
发明人： Takeshi Oono , Toshikatsu Takada , Mitsugu Onoda , Toshifumi Kojima , Toshikazu Horio , Ayako Kawamura
CPC分类号： G02B6/4231 , G02B6/4206 , G02B6/4214 , G02B6/4236 , H01L2224/16225 , H01L2924/15311
摘要： An optical device mounted substrate assembly includes a ceramic substrate having a first recess, an optical device mounted on the ceramic substrate and having one of a light emitting portion and a light receiving portion, the optical device being to be optically connected to one of an optical waveguide and an optical fiber connector in way as to align optical axes of the optical wave guide or the optical fiber connector with each other, a resin layer disposed in the first recess and having a second recess smaller in diameter than the first recess, and an alignment guide member fitted in the second recess and having a protruded portion protruding from a front surface of the ceramic substrate and fittingly engageable in an alignment hole of one of the optical waveguide and the optical fiber connector. A fabrication method of such a substrate assembly is also provided.
摘要翻译： 安装有光学装置的基板组件包括具有第一凹部的陶瓷基板，安装在陶瓷基板上并具有发光部分和光接收部分之一的光学装置，该光学装置将被光学连接到光学 波导和光纤连接器，以使光波导或光纤连接器的光轴彼此对准，树脂层设置在第一凹部中，并且具有比第一凹部更小的第二凹部，以及 对准引导构件，其安装在第二凹部中，并且具有从陶瓷基板的前表面突出的突出部分，并且可配合地接合在光波导和光纤连接器之一的对准孔中。 还提供了这种基板组件的制造方法。
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公开(公告)号：US4238659A
公开(公告)日：1980-12-09
申请号：US011412
申请日：1979-02-12
申请人： Fusao Koshiga , Jinkichi Tanaka , Itaru Watanabe , Motoaki Suzuki , Toshifumi Kojima , Hiroyoshi Matsubara , Tatsumi Osuka , Kenji Takeshige , Takashi Nagamine , Osamu Hirano
发明人： Fusao Koshiga , Jinkichi Tanaka , Itaru Watanabe , Motoaki Suzuki , Toshifumi Kojima , Hiroyoshi Matsubara , Tatsumi Osuka , Kenji Takeshige , Takashi Nagamine , Osamu Hirano
CPC分类号： B23K9/0737
摘要： In longitudinally seam-welding a pipe-blank for welded steel pipe from the inside along a groove by the GMA welding process which comprises using direct electric current supplied to a plurality of consumable electrodes in tandem through at least one cable as the welding current, at least two even-numbered consumable electrodes are used, half of said consumable electrodes being connected to said direct current so as to be positive in polarity and the remaining half of said consumable electrodes being connected to said direct current so as to be negative in polarity, to enable lines of magnetic force produced by said direct electric current for welding flowing through said at least one cable introduced into said pipe-blank to cancel each other, thereby preventing magnetization of said pipe-blank and the resulting magnetic arc blow of the welding arc.
摘要翻译： 在通过GMA焊接工艺沿着沟槽从内侧纵向焊接焊接钢管的管坯，其包括通过至少一根电缆作为焊接电流串联地供给多个可消耗电极的直流电流， 使用至少两个偶数的可消耗电极，所述可消耗电极的一半连接到所述直流电，以使其极性为正，并且所述可消耗电极的剩余一半连接到所述直流电流以使其极性为负， 以使由所述直流电流产生的电磁线能够流过通过所述至少一根引入到所述管坯中的电缆而彼此抵消，从而防止所述管坯的磁化和焊接电弧产生的电弧冲击 。
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公开(公告)号：US4988035A
公开(公告)日：1991-01-29
申请号：US403789
申请日：1989-09-05
CPC分类号： B23K35/3033 , B23K35/0238 , B23K35/302
摘要： Insert 1 comprises thin substrate made by cold-rolling, and two bonding alloy layers formed by plating on the upper and lower surfaces of substrate, respectively. Both layers is extremely thin, and is made of an alloy having a melting point lower than that of substrate. Insert 1 is used to achieve liquid phase diffusion bonding of first and second base metals. Insert 1 is interposed between first base metal and second base metal. Then, insert 1 and base metals are clamped together with a pressure of, for example, 0.5 kgf/mm.sup.2, and are placed in a atmosphere of a low pressure of about 10.sup.-4 Torr and heated to the melting point of alloy layers or to a temperature above this melting point but below the melting points of substrate and plates.
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