The invention relates to a device and method for coating substrates in a vacuum, wherein a plasma is to be generated from a target and ionized particles of the plasma are to be deposited on the substrate in the form of a layer, as has long been used in a very wide range of known PVD processes. The intention of the invention is to prevent droplets and particles from settling in the applied layer, which droplets and particles have an adverse effect on the properties of the layer, or at least to reduce the number of these droplets and particles. To solve this problem, an absorber electrode which is at an electrically positive potential is used, which electrode is a few mm away from the root of the plasma, and is arranged in front of or next to the plasma in such a way and is shaped in such a way that an electric field is formed around the absorber electrode. The electric field vector is to be oriented at least approximately orthogonally to the direction of movement of the ionized particles of the plasma.