Light-transmissive epoxy resin composition and semiconductor device

Invention Grant

US06627328B2 Light-transmissive epoxy resin composition and semiconductor device 有权

Title translation: 透光环氧树脂组合物和半导体器件

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Patent Title: Light-transmissive epoxy resin composition and semiconductor device
Patent Title (中): 透光环氧树脂组合物和半导体器件
Application No.: US09950737

Application Date: 2001-09-13
Publication No.: US06627328B2

Publication Date: 2003-09-30
Inventor: Tatsuya Kanamaru , Tsuyoshi Honda , Eiichi Asano , Toshio Shiobara
Applicant: Tatsuya Kanamaru , Tsuyoshi Honda , Eiichi Asano , Toshio Shiobara
Priority: JP2000-277405 20000913
Main IPC: H01L2912
IPC: H01L2912

Light-transmissive epoxy resin composition and semiconductor device

Abstract:

An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½

Abstract(Chinese):

包含（A）环氧树脂，（B）固化促进剂和（C）无机填料的环氧树脂组合物当满足式（1）和（2）时是透光的：其中nA是在T1° 固化的未填充组合物的c为n C为无机填料的T1℃的折射率，fA为固化的未填充组合物的折射率的温度系数，f C为折射率的温度系数无机填料。固化的组合物在宽温度范围内具有改善的耐热性，耐湿性和低应力以及高透明度。该组合物适用于光学半导体器件的密封。

Public/Granted literature

US20020058145A1 Light-transmissive epoxy resin composition and semiconductor device Public/Granted day:2002-05-16

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