发明授权
- 专利标题： Process and apparatus for flow soldering
- 专利标题（中）： 流动焊接的工艺和设备
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申请号： US09924555申请日： 2001-08-09
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公开(公告)号： US06648216B2公开(公告)日： 2003-11-18
- 发明人: Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
- 申请人： Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
- 优先权： JP2000-249588 20000821
- 主分类号： B23K3102
- IPC分类号： B23K3102
摘要：
A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.
公开/授权文献
- US20020038815A1 Process and apparatus for flow soldering 公开/授权日：2002-04-04
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