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10 条记录 (耗时 0.019 秒)

    Process and apparatus for flow soldering
    1.
    发明授权
    Process and apparatus for flow soldering 失效
    流动焊接的工艺和设备

    公开(公告)号：US06648216B2

    公开(公告)日：2003-11-18

    申请号：US09924555

    申请日：2001-08-09

    申请人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    发明人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    IPC分类号： B23K3102

    CPC分类号： B23K1/08 ,  B23K1/0016 ,  B23K2101/36 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/1121

    摘要： A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

    摘要翻译： 一种用于通过无铅焊料将电子元件安装到电路板上的流焊工艺。 将熔融焊料材料供给并附着到焊料供给区域中的板的预定部分，然后通过冷却单元在冷却区中冷却板，使得粘附到板上的焊料材料被快速冷却固化。

    Process and apparatus for flow soldering
    2.
    发明授权
    Process and apparatus for flow soldering 失效
    流动焊接的工艺和设备

    公开(公告)号：US07150387B2

    公开(公告)日：2006-12-19

    申请号：US10668355

    申请日：2003-09-24

    申请人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    发明人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    IPC分类号： B23K1/00

    CPC分类号： B23K1/08 ,  B23K1/0016 ,  B23K2101/36 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/1121

    摘要： An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

    摘要翻译： 一种通过无铅焊料将电气部件安装在基板上的装置。 本发明的装置具有焊料供给室，其中焊料材料的熔体通过焊料供给单元供应到板，使得焊料材料粘附到板的预定部分。 该设备还包括冷却室，其中板被冷却单元冷却，使得粘附到板上的焊料材料被快速冷却以固化。 调节室也可以位于焊料供应室和冷却室之间。 调节室对板进行调节，使得至少在焊料材料的快速冷却之前，确保粘附到板的焊料是完全熔融的状态。

    Solder alloy of electrode for joining electronic parts and soldering method
    7.
    发明授权
    Solder alloy of electrode for joining electronic parts and soldering method 失效
    用于接合电子零件的电极焊接合金和焊接方法

    公开(公告)号：US06325279B1

    公开(公告)日：2001-12-04

    申请号：US09569064

    申请日：2000-05-10

    申请人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    发明人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    IPC分类号： B23K3102

    CPC分类号： B23K35/262 ,  B23K2101/36 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10909

    摘要： A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy of electrode for joining electronic parts comprising Sn, Ag and Cu as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 92 to 97 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

    摘要翻译： 提出了一种无电极焊接合金，用于接合电子部件质地细腻，耐热疲劳特性优异的电极。 这是用于接合包含Sn，Ag和Cu的电子部件作为主要成分的电极用焊料合金，更具体地说，是用于接合含有92〜97重量％的电子部件的电极用焊料合金。 Sn的％，3.0〜6.0重量％ 的Ag，0.1〜2.0重量％。 ％的铜。 通过向主要由Sn组成的焊料中添加少量的Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。 此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

    Solder alloy of electrode for joining electronic parts and soldering method
    8.
    发明授权
    Solder alloy of electrode for joining electronic parts and soldering method 失效
    用于接合电子零件的电极焊接合金和焊接方法

    公开(公告)号：US6077477A

    公开(公告)日：2000-06-20

    申请号：US011393

    申请日：1998-02-05

    申请人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    发明人： Yoshinori Sakai ,  Kenichiro Suetsugu ,  Atsushi Yamaguchi

    IPC分类号： B23K35/26 ,  H05K3/34 ,  C22C13/02

    CPC分类号： B23K35/262 ,  H05K3/3463 ,  B23K2201/36 ,  H05K2201/10909 ,  H05K3/3442

    摘要： A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy for joining electronic parts comprising Sn, Ag, Bi, Cu and In as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 81 to 91 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

    摘要翻译： PCT No.PCT / JP97 / 01969 Sec。 371日期：1998年2月5日 102（e）日期1998年2月5日PCT提交1997年6月6日PCT公布。 公开号WO97 / 46350 PCT 日期1997年12月11日提出了一种用于接合电子部件质地细小且耐热疲劳特性优异的电极的无铅焊料合金。 这是用于连接包含Sn，Ag，Bi，Cu和In的电子部件作为主要组分的焊料合金，更具体地说，用于接合含有81至91重量％的电子部件的电极用焊料合金。 Sn的％，3.0〜6.0重量％ 的Ag，0.1〜2.0重量％。 ％的铜。 通过向主要由Sn组成的焊料中添加少量的Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。 此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

    Docking and active damping device for space structures
    9.
    发明授权
    Docking and active damping device for space structures 失效
    空间结构的对接和主动阻尼装置

    公开(公告)号：US5005786A

    公开(公告)日：1991-04-09

    申请号：US402586

    申请日：1989-09-05

    申请人： Osamu Okamoto ,  Teruomi Nakaya ,  Seizo Suzuki ,  Naoaki Kuwano ,  Yoshinori Sakai ,  Hiroshi Oda ,  Masao Uegusa ,  Goji Iba

    发明人： Osamu Okamoto ,  Teruomi Nakaya ,  Seizo Suzuki ,  Naoaki Kuwano ,  Yoshinori Sakai ,  Hiroshi Oda ,  Masao Uegusa ,  Goji Iba

    IPC分类号： B64G1/38 ,  B64G1/64 ,  F16F15/02

    CPC分类号： B64G1/646

    摘要： A docking and active damping device for space structures is provided, in a docking portion of one space structure to be docked, with a positioning device in which an output rotor can be moved and rotated within a two-dimensional plane by a composite rotation of one or more eccentric rotors capable of being independently driven and controlled by a direct drive motor and the output rotor, and a docking member having a docking ring and a latch mechanism are supported on the output rotor of the positioning device. A probe having a capture device capable of being protruded and driven in an axial direction by a linear motion is provided inwardly of the docking member, and the probe provides a 4-freedom movement according to a position of the passive side to capture and dock a drogue. The docking ring is supported through a strain sensor, a vibration of the passive side structure is detected, and the docking member is moved in a direction of suppressing the vibration to promptly suppress the vibration caused by disturbances from the inside and outside of the space structures.

    摘要翻译： 在一个待对接的一个空间结构的对接部分中提供用于空间结构的对接和主动阻尼装置，其具有定位装置，在该定位装置中，输出转子可以在二维平面内通过复合旋转 或更多的能够由直接驱动马达和输出转子独立驱动和控制的偏心转子，并且具有对接环和闩锁机构的对接构件被支撑在定位装置的输出转子上。 具有能够通过线性运动在轴向方向突出并被驱动的捕获装置的探针设置在对接构件的内部，并且探针根据被动侧的位置来捕获和对准一个4自由度的运动 流氓 对接环通过应变传感器支撑，检测到被动侧结构的振动，并且对接构件沿抑制振动的方向移动，以迅速地抑制由空间结构的内部和外部的干扰引起的振动 。