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24 条记录 (耗时 0.017 秒)

    Process and apparatus for flow soldering
    1.
    发明授权
    Process and apparatus for flow soldering 失效
    流动焊接的工艺和设备

    公开(公告)号：US07150387B2

    公开(公告)日：2006-12-19

    申请号：US10668355

    申请日：2003-09-24

    申请人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    发明人： Atsushi Yamaguchi ,  Masato Hirano ,  Yoshinori Sakai

    IPC分类号： B23K1/00

    CPC分类号： B23K1/08 ,  B23K1/0016 ,  B23K2101/36 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/1121

    摘要： An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

    摘要翻译： 一种通过无铅焊料将电气部件安装在基板上的装置。 本发明的装置具有焊料供给室，其中焊料材料的熔体通过焊料供给单元供应到板，使得焊料材料粘附到板的预定部分。 该设备还包括冷却室，其中板被冷却单元冷却，使得粘附到板上的焊料材料被快速冷却以固化。 调节室也可以位于焊料供应室和冷却室之间。 调节室对板进行调节，使得至少在焊料材料的快速冷却之前，确保粘附到板的焊料是完全熔融的状态。

    Method of mounting electronics component
    3.
    发明授权
    Method of mounting electronics component 失效
    安装电子部件的方法

    公开(公告)号：US5743007A

    公开(公告)日：1998-04-28

    申请号：US587461

    申请日：1996-01-17

    申请人： Hiroaki Onishi ,  Haruto Nagata ,  Masato Hirano ,  Kenichiro Suetsugu

    发明人： Hiroaki Onishi ,  Haruto Nagata ,  Masato Hirano ,  Kenichiro Suetsugu

    IPC分类号： H05K1/11 ,  H05K3/34

    CPC分类号： H05K3/3484 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/0272 ,  H05K2201/097 ,  H05K2201/10689 ,  H05K2203/0545 ,  H05K3/3452 ,  H05K3/3463 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49144

    摘要： A method for mounting on integrated circuit having many leads with narrow pitches on the printed circuit board. In a method, a resist layer is formed between lands on the board, and solder paste is applied with a stencil to the lands so that the positions of the solder paste on the lands are staggered. Then, leads of the integrated circuit are positioned on the lands. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. In a different embodiment, each land includes a first portion and a second portion having a width narrower than the first portion, and the second portions are arranged staggeredly among the lands. Then, solder paste is applied to the first portions having the wider width. Then, reflow soldering of the leads to the lands is performed with the solder paste in a nitrogen environment. If solder including bismuth is used, reflow soldering can be performed in ambient environment.

    摘要翻译： 一种用于安装在印刷电路板上具有窄间距的许多引线的集成电路上的方法。 在一种方法中，在板上的焊盘之间形成抗蚀剂层，并且将焊膏施加到焊盘上的模板，使得焊盘在焊盘上的位置错开。 然后，集成电路的引线位于焊盘上。 然后，焊锡膏在氮气环境下进行焊盘的回焊焊接。 在不同的实施例中，每个平台包括具有比第一部分窄的宽度的第一部分和第二部分，并且第二部分交错布置在平台之间。 然后，将焊膏施加到宽度较宽的第一部分。 然后，焊锡膏在氮气环境下进行焊盘的回焊焊接。 如果使用包含铋的焊料，则可以在周围环境中进行回流焊接。

    Semiconductor Memory Module Having Built-In Antenna
    7.
    发明申请
    Semiconductor Memory Module Having Built-In Antenna 失效
    具有内置天线的半导体存储模块

    公开(公告)号：US20080111756A1

    公开(公告)日：2008-05-15

    申请号：US11793301

    申请日：2006-02-02

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    IPC分类号： H01Q7/00 ,  H01Q1/38 ,  H01Q1/00

    CPC分类号： H01Q1/2275 ,  H01L23/49855 ,  H01L25/0652 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q7/00

    摘要： A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

    摘要翻译： 一种由具有半导体存储器件（16）和控制半导体器件（18）的安装模块（12）形成的半导体存储器模块，包含与控制半导体器件（18）耦合的连接端子（20）的电路板（14） ）并且被设置成从外壳（42）的表面露出，以及设置在外壳（42）内部的天线连接端子电极（22）。 以及具有片材板（26）的天线模块（24），所述片材板（26）包括设置在沿着所述边缘的所述边缘附近的一个表面上的天线（28），设置在另一个表面上的磁性物质层 ，以及设置在一个或另一个表面上的天线端子电极（38）。 天线模块（24）重叠在安装的模块（12）上，天线连接端子电极（22）与天线端子电极（38）连接。

    Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method
    8.
    发明申请
    Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method 审中-公开
    电子元件安装方法，电路基板和电路基板单元

    公开(公告)号：US20070164079A1

    公开(公告)日：2007-07-19

    申请号：US10597949

    申请日：2005-02-24

    申请人： Masato Mori ,  Hiroaki Onishi ,  Masato Hirano ,  Kazuto Nishida

    发明人： Masato Mori ,  Hiroaki Onishi ,  Masato Hirano ,  Kazuto Nishida

    IPC分类号： A47J36/02

    CPC分类号： H05K3/3442 ,  H05K3/284 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0568 ,  H05K2203/1105 ,  Y02P70/611 ,  Y02P70/613

    摘要： An electronic component mounting method comprising: supplying an unhardened reinforcing resin on a circuit substrate; supplying a solder paste on bond areas of the circuit substrate on which electrodes of the electronic components are to be bonded; placing the electronic components on the circuit substrate; and heating and then cooling the circuit substrate with the reinforcing resin, the solder paste, and the electronic components carried thereon. The mounting method enables mounting of components with high joint reliability, while incorporating the conventional surface mount process steps. The method may also be applied to the mounting of smaller electronic components with narrower pitch without deteriorating productivity or mounting quality.

    摘要翻译： 一种电子部件安装方法，包括：在电路基板上提供未硬化的增强树脂; 在所述电路基板的要与所述电子部件的电极接合的接合区域上供给焊膏; 将电子部件放置在电路基板上; 然后用加强树脂，焊膏和载体上的电子部件加热然后冷却电路基板。 安装方法能够在结合常规的表面贴装工艺步骤的同时以高接头可靠性安装部件。 该方法还可以用于安装较窄间距的较小电子部件，而不会降低生产率或安装质量。

    Process for soldering and connecting structure
    9.
    发明授权
    Process for soldering and connecting structure 失效
    焊接和连接结构的工艺

    公开(公告)号：US06871775B2

    公开(公告)日：2005-03-29

    申请号：US10325888

    申请日：2002-12-23

    申请人： Atsushi Yamaguchi ,  Masato Hirano

    发明人： Atsushi Yamaguchi ,  Masato Hirano

    IPC分类号： B23K35/00 ,  B23K35/26 ,  H05K3/24 ,  H05K3/34 ,  B23K31/02

    CPC分类号： H05K3/3463 ,  B23K35/007 ,  B23K35/262 ,  B23K35/264 ,  H05K3/244

    摘要： A barrier metal layer is provided on at least one of two electrodes, with one formed on a substrate and the other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Bi, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, when the electronic component is soldered to the substrate with the solder material such as an Sn—Bi based material or an Sb—Ag based material containing Bi, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.

    摘要翻译： 在两个电极中的至少一个电极上设置阻挡金属层，一个形成在基板上，另一个连接到电子部件，以便涂覆电极的基材，该基材由含Cu的材料 。 电子部件的电极与基板上的电极之间的焊接通过供给包含Sn和Bi的焊料材料来进行，在焊料处于熔融状态时使焊料与阻挡金属层接触; 并固化焊料。 因此，当使用诸如Sn-Bi基材料的焊料材料或含有Bi的Sb-Ag基材料将电子部件焊接到基板时，避免了焊接部件的劣化，因此足够的热疲劳强度 获得焊接部件。

    Method and apparatus for mounting electronic component
    10.
    发明授权
    Method and apparatus for mounting electronic component 失效
    电子元件安装方法及装置

    公开(公告)号：US5868302A

    公开(公告)日：1999-02-09

    申请号：US707392

    申请日：1996-09-04

    申请人： Hiroaki Onishi ,  Masato Hirano

    发明人： Hiroaki Onishi ,  Masato Hirano

    IPC分类号： B23K3/06 ,  H05K3/12 ,  B23K1/00 ,  B23K3/08 ,  B23K31/02

    CPC分类号： H05K3/1225 ,  B23K3/0638 ,  B23K2201/40

    摘要： In a method and a device for mounting an electronic component, a solder paste is printed on lands of a substrate with the use of a mask having a projecting part at a portion facing the substrate and positioned to between neighboring lands, and the projecting part prevents the solder paste on of the neighboring lands from flowing so as to come in contact with a other of the neighboring land to cause a shortcircuit between the neighboring lands.

    摘要翻译： 在用于安装电子部件的方法和装置中，使用在面向基板的部分处具有突出部分的掩模将焊膏印刷在基板的焊盘上并且定位在相邻的焊盘之间，并且突出部件防止 相邻焊盘上的焊膏流动，以便与相邻焊盘中的另一个接触以在相邻焊盘之间产生短路。