A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; and a resin encapsulant. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate and a second bottom face of the semiconductor chip is in contact with the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. A level difference exists between a first bottom face and the second bottom face of the semiconductor chip. The first and second bottom faces are respectively located at a peripheral portion and a central portion of the semiconductor chip. A part of the resin encapsulant is interposed between the first bottom face and the upper surface of the wiring substrate. Thus, the resin encapsulant and the semiconductor chip are secured more strongly to each other, and so are the resin encapsulant and the wiring substrate.