公开(公告)号：US06680524B2

公开(公告)日：2004-01-20

申请号：US09983336

申请日：2001-10-24

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

IPC分类号： H01L2302

CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/83141 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; and a resin encapsulant. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate and a second bottom face of the semiconductor chip is in contact with the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. A level difference exists between a first bottom face and the second bottom face of the semiconductor chip. The first and second bottom faces are respectively located at a peripheral portion and a central portion of the semiconductor chip. A part of the resin encapsulant is interposed between the first bottom face and the upper surface of the wiring substrate. Thus, the resin encapsulant and the semiconductor chip are secured more strongly to each other, and so are the resin encapsulant and the wiring substrate.

摘要翻译： 半导体器件包括：布线基板; 布线电极; 半导体芯片; 连接构件; 和树脂密封剂。 布线电极形成在布线基板上。 半导体芯片安装在布线基板上，半导体芯片的第二底面与布线基板接触。 形成在半导体芯片上的电极焊盘和布线电极通过连接部件彼此电连接。 例如，半导体芯片，布线电极和连接部件用树脂密封剂模制在布线基板的上表面上。 在半导体芯片的第一底面和第二底面之间存在水平差。 第一和第二底面分别位于半导体芯片的周边部分和中心部分。 树脂密封剂的一部分插入在布线基板的第一底面和上表面之间。 因此，树脂密封剂和半导体芯片彼此更牢固地固定，树脂密封剂和布线基板也被固定。

公开(公告)号：US06680220B2

公开(公告)日：2004-01-20

申请号：US10152725

申请日：2002-05-23

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

IPC分类号： H01L2144

CPC分类号： H01L21/561 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; a resin encapsulant; and a mark member. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. The mark member is embedded in the upper surface of the resin encapsulant. The mark member, which is transferred from a transfer sheet in a single process step, is highly visible and can be formed efficiently.

摘要翻译： 半导体器件包括：布线基板; 布线电极; 半导体芯片; 连接构件; 树脂密封剂; 和标记成员。 布线电极形成在布线基板上。 半导体芯片安装在布线基板上。 形成在半导体芯片上的电极焊盘和布线电极通过连接部件彼此电连接。 例如，半导体芯片，布线电极和连接部件用树脂密封剂模制在布线基板的上表面上。 标记构件嵌入树脂密封剂的上表面。 在单个工艺步骤中从转印纸转印的标记部件是高度可见的并且可以有效地形成。

公开(公告)号：US20050194676A1

公开(公告)日：2005-09-08

申请号：US11071343

申请日：2005-03-03

申请人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

发明人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

IPC分类号： H01L23/28 ,  H01L21/44 ,  H01L21/48 ,  H01L21/60 ,  H01L23/04 ,  H01L23/34 ,  H01L23/48 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L21/566 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/645 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/16257 ,  H01L2224/16258 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  Y10T156/10 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/48145 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/01033

摘要： There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.

摘要翻译： 设置有引线框架，该引线框架包括设置在平面上的多个第一外部端子部分5，由各个第一外部端子部分的后表面形成的内部引线部分6，其布置成围绕内部引线部分内的区域; 由位于相应的内部引线部分外部的凸起部分的最上表面形成的第二外部端子部分7; 半导体元件2通过凸块3接合到内引线部分; 以及封装树脂4，其封装半导体元件和内引线部分的周围。 第一外部端子部分沿着该区域的周边布置在封装树脂的下表面区域中，并且第二外部端子部分暴露在封装树脂的上表面上。 用于电连接的多个端子8以第一外部端子部分内的区域中的网格图案设置并暴露在封装树脂的下表面上。 可以并入多个半导体元件或线圈和电阻器，并且可以堆叠另外的半导体器件。

公开(公告)号：US07495319B2

公开(公告)日：2009-02-24

申请号：US11071343

申请日：2005-03-03

申请人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

发明人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L21/566 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/645 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/16257 ,  H01L2224/16258 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  Y10T156/10 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/48145 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/01033

摘要： There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.

摘要翻译： 设置有引线框架，该引线框架包括设置在平面上的多个第一外部端子部分5，由各个第一外部端子部分的后表面形成的内部引线部分6，其布置成围绕内部引线部分内的区域; 由位于相应的内部引线部分外部的凸起部分的最上表面形成的第二外部端子部分7; 半导体元件2通过凸块3接合到内引线部分; 以及封装树脂4，其封装半导体元件和内引线部分的周围。 第一外部端子部分沿着该区域的周边布置在封装树脂的下表面区域中，并且第二外部端子部分暴露在封装树脂的上表面上。 用于电连接的多个端子8以第一外部端子部分内的区域中的网格图案设置并暴露在封装树脂的下表面上。 可以并入多个半导体元件或线圈和电阻器，并且可以堆叠另外的半导体器件。

公开(公告)号：US06559528B2

公开(公告)日：2003-05-06

申请号：US09785503

申请日：2001-02-20

申请人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

发明人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

IPC分类号： H01L23498

CPC分类号： H01L24/97 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49872 ,  H01L24/45 ,  H01L24/48 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/85399 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrically connecting together a portion 12b of the first element electrodes 12 and the second element electrodes 14, an insulation layer 17 covering a major surface 11a of the first semiconductor element 11 and a backside surface 13b of the second semiconductor element 13, a wiring layer 22 formed on the insulation layer 17 and electrically connected to the first element electrode portion 12b exposed in an opening portion 21, and an external electrode 23 formed, as a portion of the wiring layer 22, on the insulation layer 17.

摘要翻译： 公开了一种半导体器件10，其包括具有第一元件电极12的布置的第一半导体元件11，具有第二元件电极14的布置的第二半导体元件13，将第一元件电极的部分12b电连接在一起的连接构件15 12和第二元件电极14，覆盖第一半导体元件11的主表面11a和第二半导体元件13的背面13b的绝缘层17，形成在绝缘层17上并电连接到第二半导体元件13的布线层22的布线层22。 露出在开口部分21中的第一元件电极部分12b和作为布线层22的一部分形成在绝缘层17上的外部电极23。

公开(公告)号：US06924173B2

公开(公告)日：2005-08-02

申请号：US10387457

申请日：2003-03-14

申请人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

发明人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

IPC分类号： H01L25/18 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L21/58

CPC分类号： H01L24/97 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49872 ,  H01L24/45 ,  H01L24/48 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/85399 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrically connecting together a portion 12b of the first element electrodes 12 and the second element electrodes 14, an insulation layer 17 covering a major surface 11a of the first semiconductor element 11 and a backside surface 13b of the second semiconductor element 13, a wiring layer 22 formed on the insulation layer 17 and electrically connected to the first element electrode portion 12b exposed in an opening portion 21, and an external electrode 23 formed, as a portion of the wiring layer 22, on the insulation layer 17.

摘要翻译： 公开了一种半导体器件10，其包括具有第一元件电极12的布置的第一半导体元件11，具有第二元件电极14的布置的第二半导体元件13，连接构件15，其将第一元件 电极12和第二元件电极14，覆盖第一半导体元件11的主表面11a和第二半导体元件13的背面13b的绝缘层17，形成在绝缘层17上的布线层22， 连接到暴露在开口部分21中的第一元件电极部分12b和形成为绝缘层17上的布线层22的一部分的外部电极23。

公开(公告)号：US06713880B2

公开(公告)日：2004-03-30

申请号：US10066650

申请日：2002-02-06

申请人： Ryuichi Sahara ,  Hiroaki Fujimoto

发明人： Ryuichi Sahara ,  Hiroaki Fujimoto

IPC分类号： H01L2348

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip, an insulating layer formed on a region excluding the plurality of electrode pads on the principal surface of the semiconductor chip, a plurality of contact pads arranged on the insulating layer, a wiring layer electrically connected to at least one of the plurality of electrode pads and electrically connected to at least one of the plurality of contact pads, thereby establishing rewiring connection, an insulative resin layer formed on a region excluding the plurality of contact pads on the principal surface of the semiconductor chip, a protruded electrode provided on each of the plurality of contact pads, and an underfill material layer provided on the insulative resin layer in such a manner that the top of the protruded electrode is exposed.

摘要翻译： 半导体器件包括半导体芯片，形成在除了半导体芯片的主表面上的多个电极焊盘之外的区域上的绝缘层，布置在绝缘层上的多个接触焊盘，电连接到至少一个 并且电连接到所述多个接触焊盘中的至少一个，从而建立重新布线连接，形成在除了所述半导体芯片的主表面上的多个接触焊盘之外的区域上的绝缘树脂层，突出的 设置在所述多个接触垫中的每一个上的电极以及设置在所述绝缘树脂层上的底部填充材料层，使得所述突出电极的顶部露出。

公开(公告)号：US20050199979A1

公开(公告)日：2005-09-15

申请号：US11122094

申请日：2005-05-05

申请人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

发明人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

IPC分类号： H01L21/768 ,  H01L21/822 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L27/04 ,  H01L29/00

CPC分类号： H01L23/3114 ,  H01L23/5227 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.

摘要翻译： 半导体器件具有半导体芯片，第一绝缘膜和电感器。 半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。 绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。 电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。 第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

公开(公告)号：US06512298B2

公开(公告)日：2003-01-28

申请号：US09984191

申请日：2001-10-29

申请人： Ryuichi Sahara ,  Kazumi Watase ,  Takahiro Kumakawa ,  Kazuyuki Kainoh ,  Nozomi Shimoishizaka

发明人： Ryuichi Sahara ,  Kazumi Watase ,  Takahiro Kumakawa ,  Kazuyuki Kainoh ,  Nozomi Shimoishizaka

IPC分类号： H01L2940

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L23/522 ,  H01L23/5227 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05552 ,  H01L2924/013

摘要： A first element electrode and a second element electrode connected electrically to a semiconductor element on a substrate are formed, and then an insulating film is formed on the substrate including the element electrodes. Thereafter, a first opening for exposing the first element electrode and a second opening for exposing the second element electrode are formed on the insulating film. Then, a first external electrode connected to the first element electrode via the first opening is formed immediately above the first element electrode. Furthermore, a second external electrode and a connecting wire having one end connected to the second element electrode via the second opening and the other end connected to the second external electrode are formed on the insulating film.

公开(公告)号：US06914331B2

公开(公告)日：2005-07-05

申请号：US10442139

申请日：2003-05-21

申请人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

发明人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

IPC分类号： H01L21/768 ,  H01L21/822 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L27/04 ,  H01L23/498

CPC分类号： H01L23/3114 ,  H01L23/5227 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.

摘要翻译： 半导体器件具有半导体芯片，第一绝缘膜和电感器。 半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。 绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。 电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。 第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。