Invention Grant
- Patent Title: Semiconductor memory device allowing high density structure or high performance
- Patent Title (中): 半导体存储器件允许高密度结构或高性能
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Application No.: US10126622Application Date: 2002-04-22
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Publication No.: US06724679B2Publication Date: 2004-04-20
- Inventor: Tsutomu Nagasawa , Hideki Yonetani , Kozo Ishida , Shinichi Jinbo , Makoto Suwa , Tadaaki Yamauchi , Junko Matsumoto , Zengcheng Tian , Takeo Okamoto
- Applicant: Tsutomu Nagasawa , Hideki Yonetani , Kozo Ishida , Shinichi Jinbo , Makoto Suwa , Tadaaki Yamauchi , Junko Matsumoto , Zengcheng Tian , Takeo Okamoto
- Priority: JP2001-329188 20011026
- Main IPC: G11C800
- IPC: G11C800

Abstract:
A semiconductor memory device includes banks, predecoders, a latch circuit, a counter, a fuse and buffers. The bank includes a plurality of memory cells arranged in rows and columns, and others. The predecoders are disposed in a central portion of the semiconductor memory device. The predecoder produces a predecode signal for selecting each of the banks based on a bank address received from the buffer, and outputs the predecode signal to the banks. The predecoder produces the predecode signal for selecting each of the banks based on the bank address, and outputs the predecode signal to the banks. Consequently, interconnections in the central portion can be reduced in number.
Public/Granted literature
- US20030081490A1 Semiconductor memory device allowing high density structure or high performance Public/Granted day:2003-05-01
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