发明授权
- 专利标题： Substrate processing device, substrate conveying device, and substrate processing method
- 专利标题（中）： 基板处理装置，基板输送装置及基板处理方法
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申请号： US09503916申请日： 2000-02-15
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公开(公告)号： US06742977B1公开(公告)日： 2004-06-01
- 发明人: Satohiro Okayama , Motoichi Kanazawa , Takeshige Ishida , Tomohiko Takeda , Yukio Akita , Satoru Ichimura , Kazunori Suzuki , Teruo Yoshino , Tokunobu Akao , Yasunobu Nakayama
- 申请人： Satohiro Okayama , Motoichi Kanazawa , Takeshige Ishida , Tomohiko Takeda , Yukio Akita , Satoru Ichimura , Kazunori Suzuki , Teruo Yoshino , Tokunobu Akao , Yasunobu Nakayama
- 优先权： JP11-036447 19990215; JP2000-026703 20000203
- 主分类号： H01L2168
- IPC分类号： H01L2168
摘要：
An unprocessed substrate is conveyed to a film-processing chamber at the same time a processed substrate is conveyed to a substrate preparation chamber, reducing the substrate processing cycle, thereby increasing the yield per unit time. The substrate preparation chamber has a two-tiered structure for receiving processed substrates and unprocessed substrates. A two-tiered transfer robot allows the substrates to be removed or placed into the preparation and process chambers at the same time, thus decreasing the cycle time for processing a substrate.
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