- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US10337704申请日: 2003-01-07
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公开(公告)号: US06743649B2公开(公告)日: 2004-06-01
- 发明人: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yasuyuki Arai
- 申请人: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yasuyuki Arai
- 优先权: JP11-206942 19990722
- 主分类号: H01L2100
- IPC分类号: H01L2100
摘要:
By providing appropriate TFT structures arranged in various circuits of the semiconductor device in response to the functions required by the circuits, it is made possible to improve the operating performances and the reliability of a semiconductor device, reduce power consumption as well as realizing reduced manufacturing cost and increase in yield by lessening the number of processing steps. An LDD region of a TFT is formed to have a concentration gradient of an impurity element for controlling conductivity which becomes higher as the distance from a drain region decreases. In order to form such an LDD region having a concentration gradient of an impurity element, the present invention uses a method in which a gate electrode having a taper portion is provided to thereby dope an ionized impurity element for controlling conductivity accelerated in the electric field so that it penetrates through the gate electrode and a gate insulating film into a semiconductor layer.
公开/授权文献
- US20030180996A1 Semiconductor device and manufacturing method thereof 公开/授权日:2003-09-25
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