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US06777312B2 Wafer-level transfer of membranes in semiconductor processing 失效
晶圆级半导体加工中的膜转移

  • Patent Title: Wafer-level transfer of membranes in semiconductor processing
  • Patent Title (中): 晶圆级半导体加工中的膜转移
  • Application No.: US10005765
    Application Date: 2001-11-02
  • Publication No.: US06777312B2
    Publication Date: 2004-08-17
  • Inventor: Eui-Hyeok Yang , Dean V. Wiberg
  • Applicant: Eui-Hyeok Yang , Dean V. Wiberg
  • Main IPC: H01L2130
  • IPC: H01L2130
Wafer-level transfer of membranes in semiconductor processing
Abstract:
Techniques for transferring a membrane from one wafer to another wafer to form integrated semiconductor devices.
Abstract(Chinese):

将膜从一个晶片转移到另一个晶片以形成集成的半导体器件的技术。

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