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公开(公告)号：US06777312B2
公开(公告)日：2004-08-17
申请号：US10005765
申请日：2001-11-02
申请人： Eui-Hyeok Yang , Dean V. Wiberg
发明人： Eui-Hyeok Yang , Dean V. Wiberg
IPC分类号： H01L2130
CPC分类号： B81C3/001 , B81B2201/042 , B81B2203/0127 , B81C1/00357 , B81C2201/019 , B81C2201/0191 , B81C2203/038 , H01L21/2007 , H01L21/76251
摘要： Techniques for transferring a membrane from one wafer to another wafer to form integrated semiconductor devices.
摘要翻译： 将膜从一个晶片转移到另一个晶片以形成集成的半导体器件的技术。
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2.发明授权公开(公告)号：US07396478B2
公开(公告)日：2008-07-08
申请号：US11850458
申请日：2007-09-05
申请人： Ken J. Hayworth , Karl Y. Yee , Kirill V. Shcheglov , Youngsam Bae , Dean V. Wiberg , A. Dorian Challoner , Chris S. Peay
发明人： Ken J. Hayworth , Karl Y. Yee , Kirill V. Shcheglov , Youngsam Bae , Dean V. Wiberg , A. Dorian Challoner , Chris S. Peay
CPC分类号： G01C19/5719 , B81B7/007
摘要： A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.
摘要翻译： 使用MISR密封MEMS器件的多内密封环（MISR）微机电系统（MEMS）真空包装方法。 该方法通过将封盖板晶片与基板晶片结合，将具有金属密封环的封盖板与具有金属密封环的基板结合。 散装电极可用于在基板和封盖板上的密封环之间提供导电路径。 所有密封件仅使用沉积在基板和封盖板晶片的抛光表面上的金属对金属密封环制成。 然而，通过制造通过盖板的通孔来提供多个电馈通金属迹线，用于从封装的外部通过通孔到封装的内部进行电连接。 每个金属密封环都用于气密密封的双重目的，并提供电气馈通金属痕迹。
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公开(公告)号：US07347095B2
公开(公告)日：2008-03-25
申请号：US11199004
申请日：2005-08-08
IPC分类号： G01P9/04
CPC分类号： B81C3/001 , G01C19/5684 , Y10T29/49002 , Y10T29/49007 , Y10T29/4902
摘要： The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.
摘要翻译： 本发明公开了一种具有整体式谐振器的惯性传感器。 典型的传感器包括用于感测惯性传感器的运动的平面机械谐振器和用于容纳谐振器的壳体。 谐振器和壳体的壁通过蚀刻工艺来定义。 制造谐振器的典型方法包括蚀刻基板，将晶片接合到蚀刻的基板上，通过蚀刻晶片以形成平面机械谐振器和壳体的壁并将端盖晶片结合到壁上以完成壳体。
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4.发明授权公开(公告)号：US07285844B2
公开(公告)日：2007-10-23
申请号：US10865344
申请日：2004-06-10
申请人： Ken J. Hayworth , Karl Y. Yee , Kirill V. Shcheglov , Youngsam Bae , Dean V. Wiberg , A. Dorian Challoner , Chris S. Peay
发明人： Ken J. Hayworth , Karl Y. Yee , Kirill V. Shcheglov , Youngsam Bae , Dean V. Wiberg , A. Dorian Challoner , Chris S. Peay
IPC分类号： H01L23/552
CPC分类号： G01C19/5719 , B81B7/007
摘要： A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.
摘要翻译： 使用MISR密封MEMS器件的多重内密封环（MISR）微机电系统（MEMS）真空封装。 该方法通过将封盖板晶片与基板晶片结合，将具有金属密封环的封盖板与具有金属密封环的基板结合。 散装电极可用于在基板和封盖板上的密封环之间提供导电路径。 所有密封件仅使用沉积在基板和封盖板晶片的抛光表面上的金属对金属密封环制成。 然而，通过制造通过盖板的通孔来提供多个电馈通金属迹线，用于从封装的外部通过通孔到封装的内部进行电连接。 每个金属密封环都用于气密密封的双重目的，并提供电气馈通金属痕迹。
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公开(公告)号：US06944931B2
公开(公告)日：2005-09-20
申请号：US10639135
申请日：2003-08-12
IPC分类号： B81C3/00 , G01C19/5684 , G01R3/00
CPC分类号： B81C3/001 , G01C19/5684 , Y10T29/49002 , Y10T29/49007 , Y10T29/4902
摘要： The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.
摘要翻译： 本发明公开了一种具有整体式谐振器的惯性传感器。 典型的传感器包括用于感测惯性传感器的运动的平面机械谐振器和用于容纳谐振器的壳体。 谐振器和壳体的壁通过蚀刻工艺来定义。 制造谐振器的典型方法包括蚀刻基板，将晶片接合到蚀刻的基板上，通过蚀刻晶片以形成平面机械谐振器和壳体的壁并将端盖晶片结合到壁上以完成壳体。
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公开(公告)号：US06859725B2
公开(公告)日：2005-02-22
申请号：US10370750
申请日：2003-02-20
CPC分类号： G01S19/49 , G01C21/165 , G01S19/34
摘要： A device for determining a user positioning including an RF position locating device (e.g., a GPS receiver) for intermittently determining a reference position and an inertial sensing system for determining a position change from the reference position. A current position is determined from the reference position and the position change and the inertial sensing system operates at a lower power level than the RF position locating device.
摘要翻译： 一种用于确定用户定位的装置，包括用于间歇地确定参考位置的RF位置定位装置（例如，GPS接收器）和用于确定从参考位置的位置变化的惯性感测系统。 从参考位置和位置变化确定当前位置，并且惯性感测系统在比RF位置定位装置低的功率水平下操作。
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