发明授权
- 专利标题： Semiconductor wafer and device for semiconductor device manufacturing process
- 专利标题（中）： 半导体晶圆及半导体装置制造工艺
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申请号： US10019056申请日： 2002-04-22
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公开(公告)号： US06787797B2公开(公告)日： 2004-09-07
- 发明人: Kiyoshi Demizu , Tadahiro Kato , Shigeyoshi Netsu
- 申请人： Kiyoshi Demizu , Tadahiro Kato , Shigeyoshi Netsu
- 优先权： JP2000-128502 20000427
- 主分类号： H01L2358
- IPC分类号： H01L2358
摘要：
In order to improve the productivity or production yield of chips in the process for device fabrication, the present invention provides a wafer or an apparatus of process for fabricating semiconductor devices having the backside of the wafer or the surface of a wafer holding means adjusted so as to have a distribution in contact surface density between the surface of the wafer holding means and the backside of the wafer when the semiconductor wafer is held on the wafer holding means in the process for fabricating devices.
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