发明授权
US06795161B2 Exposure apparatus, method of manufacturing semiconductor devices and plant therefor 失效
曝光装置,半导体装置的制造方法及其制造方法

  • 专利标题: Exposure apparatus, method of manufacturing semiconductor devices and plant therefor
  • 专利标题(中): 曝光装置,半导体装置的制造方法及其制造方法
  • 申请号: US09811419
    申请日: 2001-03-20
  • 公开(公告)号: US06795161B2
    公开(公告)日: 2004-09-21
  • 发明人: Masaya OguraEiichi MurakamiNobuaki Ogushi
  • 申请人: Masaya OguraEiichi MurakamiNobuaki Ogushi
  • 优先权: JP2000-083942 20000324
  • 主分类号: G03B2752
  • IPC分类号: G03B2752
Exposure apparatus, method of manufacturing semiconductor devices and plant therefor
摘要:
An exposure apparatus having an illuminating optics unit for irradiating a reticle, on which a predetermined pattern has been formed, with exposing light emitted from an exposure light source, a reticle stage on which the reticle is placed, a projection optics unit for projecting the predetermined pattern of the reticle onto a substrate, and a substrate stage on which the substrate is placed. The apparatus includes at least one chamber for internally accommodating the illuminating optics unit, the reticle stage, the projection optics unit and the substrate stage, a first pressure control device for making a value of pressure inside the at least one chamber higher than a value of pressure outside the at least one chamber, and a first correction device for correcting optical characteristics of the projection optics unit, by performing at least one of (i) moving an adjustment unit for adjusting the optical characteristics of the projection optics unit and (ii) shifting a wavelength of the exposing light, in accordance with the value of the pressure inside the at least one chamber.
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