Invention Grant
- Patent Title: Forming a through hole in a photoimageable dielectric structure
- Patent Title (中): 在可光成像的电介质结构中形成通孔
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Application No.: US10266020Application Date: 2002-10-07
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Publication No.: US06830875B2Publication Date: 2004-12-14
- Inventor: Stephen J. Fuerniss , Gary Johansson , Ross W. Keesler , John M. Lauffer , Voya R. Markovich , Peter A. Moschak , David J. Russell , William E. Wilson
- Applicant: Stephen J. Fuerniss , Gary Johansson , Ross W. Keesler , John M. Lauffer , Voya R. Markovich , Peter A. Moschak , David J. Russell , William E. Wilson
- Main IPC: G03F700
- IPC: G03F700

Abstract:
A method for forming an electronic structure. Provides is a layer that includes a cylindrical volume of a photoimageable dielectric (PID) material, an annular volume of the PID material circumscribing the cylindrical volume, and a remaining volume of the PID material circumscribing the annular volume. The layer is photolithograhically exposed to radiation. The annular volume is fully cured by the radiation. The remaining volume is partially cured by the remaining volume by said radiation. The method prevents curing of the cylindrical volume, wherein the PID material in the cylindrical volume remains uncured.
Public/Granted literature
- US20030047357A1 Forming a through hole in a photoimageable dielectric structure Public/Granted day:2003-03-13
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