发明授权
- 专利标题： Forming a through hole in a photoimageable dielectric structure
- 专利标题（中）： 在可光成像的电介质结构中形成通孔
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申请号： US10266020申请日： 2002-10-07
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公开(公告)号： US06830875B2公开(公告)日： 2004-12-14
- 发明人: Stephen J. Fuerniss , Gary Johansson , Ross W. Keesler , John M. Lauffer , Voya R. Markovich , Peter A. Moschak , David J. Russell , William E. Wilson
- 申请人： Stephen J. Fuerniss , Gary Johansson , Ross W. Keesler , John M. Lauffer , Voya R. Markovich , Peter A. Moschak , David J. Russell , William E. Wilson
- 主分类号： G03F700
- IPC分类号： G03F700
摘要：
A method for forming an electronic structure. Provides is a layer that includes a cylindrical volume of a photoimageable dielectric (PID) material, an annular volume of the PID material circumscribing the cylindrical volume, and a remaining volume of the PID material circumscribing the annular volume. The layer is photolithograhically exposed to radiation. The annular volume is fully cured by the radiation. The remaining volume is partially cured by the remaining volume by said radiation. The method prevents curing of the cylindrical volume, wherein the PID material in the cylindrical volume remains uncured.