发明授权
- 专利标题： High frequency circuit chip and method of producing the same
- 专利标题（中）： 高频电路芯片及其制造方法
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申请号： US10087915申请日： 2002-03-05
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公开(公告)号： US06838377B2公开(公告)日： 2005-01-04
- 发明人: Yoshiyuki Tonami , Mitsunori Hatada
- 申请人： Yoshiyuki Tonami , Mitsunori Hatada
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP2001-060061 20010305
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/48 ; H01L23/66 ; H01P3/08 ; H01P11/00 ; H05K1/02 ; H05K1/03 ; H05K1/16 ; H05K3/04 ; H05K3/40 ; H01L21/44
摘要：
In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.