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公开(公告)号:US20050104218A1
公开(公告)日:2005-05-19
申请号:US10993197
申请日:2004-11-19
申请人: Yoshiyuki Tonami , Mitsunori Hatada
发明人: Yoshiyuki Tonami , Mitsunori Hatada
IPC分类号: H01L23/12 , H01L21/48 , H01L23/66 , H01P3/08 , H01P11/00 , H05K1/02 , H05K1/03 , H05K1/16 , H05K3/04 , H05K3/40 , H01L23/495
CPC分类号: H05K3/4061 , H01L21/4857 , H01L21/486 , H01L23/66 , H01L2924/0002 , H05K1/0237 , H05K1/0306 , H05K1/16 , H05K1/167 , H05K3/048 , H05K2201/0317 , H05K2203/025 , H05K2203/1461 , H01L2924/00
摘要: In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.
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公开(公告)号:US06838377B2
公开(公告)日:2005-01-04
申请号:US10087915
申请日:2002-03-05
申请人: Yoshiyuki Tonami , Mitsunori Hatada
发明人: Yoshiyuki Tonami , Mitsunori Hatada
IPC分类号: H01L23/12 , H01L21/48 , H01L23/66 , H01P3/08 , H01P11/00 , H05K1/02 , H05K1/03 , H05K1/16 , H05K3/04 , H05K3/40 , H01L21/44
CPC分类号: H05K3/4061 , H01L21/4857 , H01L21/486 , H01L23/66 , H01L2924/0002 , H05K1/0237 , H05K1/0306 , H05K1/16 , H05K1/167 , H05K3/048 , H05K2201/0317 , H05K2203/025 , H05K2203/1461 , H01L2924/00
摘要: In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.
摘要翻译: 在其中在具有通孔的基板上布置布线图案的高频电路芯片的生产中,通过将导电浆料填充到穿孔中并将其烧结而形成通孔的连接电极,并且布线 图案由剥离法形成。 此外,至少将要形成其上的布线图案的基板的表面进行镜面抛光,然后通过剥离方法在镜面抛光表面上形成布线图案。
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