Invention Grant
- Patent Title: Chemical mechanical polishing systems and methods for their use
- Patent Title (中): 化学机械抛光系统及其使用方法
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Application No.: US10324634Application Date: 2002-12-19
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Publication No.: US06840971B2Publication Date: 2005-01-11
- Inventor: Shumin Wang , Vlasta Brusic Kaufman
- Applicant: Shumin Wang , Vlasta Brusic Kaufman
- Applicant Address: US IL Aurora
- Assignee: Cabot microelectronics Corporation
- Current Assignee: Cabot microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent A. Blair Hughes
- Main IPC: B24B57/02
- IPC: B24B57/02 ; C09C1/68 ; C09G1/02 ; C09K3/14 ; C23F3/06 ; H01L21/304 ; H01L21/321 ; B24D3/02
Abstract:
Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
Public/Granted literature
- US20030166337A1 Chemical mechanical polishing systems and methods for their use Public/Granted day:2003-09-04
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