发明授权
US06857556B2 Method for bonding different members and composite members bonded by the method
有权
通过该方法粘接不同构件和复合构件的方法
- 专利标题： Method for bonding different members and composite members bonded by the method
- 专利标题（中）： 通过该方法粘接不同构件和复合构件的方法
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申请号： US10033797申请日： 2002-01-03
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公开(公告)号： US06857556B2公开(公告)日： 2005-02-22
- 发明人: Takahiro Ishikawa , Masayuki Shinkai , Masahiro Kida
- 申请人： Takahiro Ishikawa , Masayuki Shinkai , Masahiro Kida
- 申请人地址： JP
- 专利权人： NGK Insulators, Ltd.
- 当前专利权人： NGK Insulators, Ltd.
- 当前专利权人地址： JP
- 代理机构： Parkhurst & Wendel, L.L.P.
- 优先权： JP11-180902 19990625
- 主分类号： B23K1/19
- IPC分类号： B23K1/19 ; B23K1/20 ; B23K31/02 ; B23K35/00 ; B23K35/02 ; B23K35/28 ; B23K35/30 ; B23K35/32 ; B23K103/18 ; C04B37/02
摘要：
A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.
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