发明授权
- 专利标题： Method for forming wiring structure
- 专利标题（中）： 形成布线结构的方法
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申请号： US10328178申请日： 2002-12-26
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公开(公告)号： US06858549B2公开(公告)日： 2005-02-22
- 发明人: Masashi Hamanaka , Takeshi Harada , Hideaki Yoshida , Tetsuya Ueda
- 申请人： Masashi Hamanaka , Takeshi Harada , Hideaki Yoshida , Tetsuya Ueda
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2001-396421 20011227
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/3105 ; H01L21/321 ; H01L21/768 ; H01L21/4763
摘要：
After a plurality of grooves are formed in an insulating film and in an antireflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled. Subsequently, the portions of the conductive film outside the grooves are removed by a first polishing step and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, foreign matter adhered to the surface of the anti-reflection film is removed and a third polishing step is conducted on the surface of the anti-reflection film using an abrasive agent of the same type as used in the first polishing step of the conductive film.
公开/授权文献
- US20030216019A1 Method for forming wiring structure 公开/授权日：2003-11-20
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