公开(公告)号：US06191038B1

公开(公告)日：2001-02-20

申请号：US09145126

申请日：1998-09-01

申请人： Hideaki Yoshida ,  Masashi Hamanaka

发明人： Hideaki Yoshida ,  Masashi Hamanaka

IPC分类号： H01L21302

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B49/16 ,  H01L21/30625

摘要： A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.

摘要翻译： 抛光垫固定在安装成可旋转的抛光台上。 磨料供应管将磨料供应到抛光垫上。 衬底保持器安装成能够在抛光垫上方旋转，保持要抛光的衬底并将衬底压靠在抛光垫上，从而抛光衬底。 修整器被安装成可以在抛光垫上方旋转，并且打磨抛光垫。 扭矩检测器检测研磨台板的旋转扭矩或基板保持器的旋转扭矩。 如果由转矩检测器检测到的转动转矩等于或小于预定值，则修整器控制器使修整器穿着抛光垫。

公开(公告)号：US06881660B2

公开(公告)日：2005-04-19

申请号：US10328170

申请日：2002-12-26

申请人： Takeshi Harada ,  Hideaki Yoshida ,  Tetsuya Ueda ,  Masashi Hamanaka

发明人： Takeshi Harada ,  Hideaki Yoshida ,  Tetsuya Ueda ,  Masashi Hamanaka

IPC分类号： H01L21/02 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/4763

CPC分类号： H01L23/53238 ,  H01L21/02074 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/7684 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： After a plurality of grooves are formed in an insulating film, a barrier metal film and a conductive film are deposited successively on the insulating film such that each of the grooves is filled completely therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, a foreign matter adhered to the surface to be polished during polishing is removed and then a surface of the insulating film is polished.

摘要翻译： 在绝缘膜中形成多个沟槽之后，在绝缘膜上依次沉积阻挡金属膜和导电膜，使得每个槽完全填充。 随后，通过研磨去除沟槽外部的导电膜的部分，然后通过抛光除去槽外部的阻挡金属膜的部分。 此后，除去在抛光期间附着于抛光表面的异物，然后抛光绝缘膜的表面。

公开(公告)号：US06416617B2

公开(公告)日：2002-07-09

申请号：US09725844

申请日：2000-11-30

申请人： Hideaki Yoshida ,  Masashi Hamanaka

发明人： Hideaki Yoshida ,  Masashi Hamanaka

IPC分类号： B24B4900

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B49/16 ,  H01L21/30625

摘要： A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.

摘要翻译： 抛光垫固定在安装成可旋转的抛光台上。 磨料供应管将磨料供应到抛光垫上。 衬底保持器安装成能够在抛光垫上方旋转，保持要抛光的衬底并将衬底压靠在抛光垫上，从而抛光衬底。 修整器被安装成可以在抛光垫上方旋转，并且打磨抛光垫。 扭矩检测器检测研磨台板的旋转扭矩或基板保持器的旋转扭矩。 如果由转矩检测器检测到的转动转矩等于或小于预定值，则修整器控制器使修整器穿着抛光垫。

公开(公告)号：US06248660B1

公开(公告)日：2001-06-19

申请号：US09012961

申请日：1998-01-26

申请人： Masashi Hamanaka ,  Tetsuo Ishida ,  Masafumi Shishino

发明人： Masashi Hamanaka ,  Tetsuo Ishida ,  Masafumi Shishino

IPC分类号： H01L214763

CPC分类号： H01L21/7684 ,  H01L21/3212

摘要： A method for forming a metallic plug capable of preventing the occurrence of defects due to a short between conductive layers and the decrease of reliability in a conductive layer caused by a change of plug resistance by polishing and eliminating a filling film and an adhesive layer using a slurry for polishing a metal after eliminating a part of the filling film by dry etching beforehand. A metal plug can be obtained by the following steps: forming an end connection opened in an interlayer dielectric so as to expose the surface of a conductive layer under the interlayer dielectric; forming an adhesive layer on the exposed conductive layer and on the interlayer dielectric; forming a filling film on the adhesive layer, which fills the end connection completely; eliminating 60% or more of the film thickness of the filling film formed by dry etching; and polishing and eliminating the filling film and the adhesive layer using a slurry for polishing a metal.

摘要翻译： 一种用于形成金属插塞的方法，其能够防止由于导电层之间的短路导致的缺陷的发生，并且由于通过抛光改变插塞电阻而导致的导电层的可靠性降低，并且使用 预先通过干蚀刻去除一部分填充膜后的金属抛光浆料。 可以通过以下步骤获得金属插塞：在层间电介质中形成开口的端部连接，以露出层间电介质下的导电层的表面; 在暴露的导电层和层间电介质上形成粘合剂层; 在粘合剂层上形成填充膜，其完全填充端部连接; 消除由干蚀刻形成的填充膜的膜厚度的60％以上; 并使用用于抛光金属的浆料抛光和去除填充膜和粘合剂层。

公开(公告)号：US06919267B2

公开(公告)日：2005-07-19

申请号：US10328175

申请日：2002-12-26

申请人： Tetsuya Ueda ,  Masashi Hamanaka ,  Takeshi Harada ,  Hideaki Yoshida

发明人： Tetsuya Ueda ,  Masashi Hamanaka ,  Takeshi Harada ,  Hideaki Yoshida

IPC分类号： H01L21/02 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L21/4763

CPC分类号： H01L21/7684 ,  H01L21/02074 ,  H01L21/31053 ,  H01L21/3212

摘要： After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, respective foreign matters adhered to a polishing pad and to a surface to be polished during polishing are removed and then a surface of the anti-reflection film is polished.

摘要翻译： 在绝缘膜和绝缘膜上的防反射膜中形成多个沟槽之后，在防反射膜上沉积阻挡金属膜和导电膜，使得每个槽被填充。 随后，通过研磨去除沟槽外部的导电膜的部分，然后通过抛光除去槽外部的阻挡金属膜的部分。 此后，除去在抛光时附着于抛光垫和抛光表面的各异物，然后抛光防反射膜的表面。

公开(公告)号：US06759322B2

公开(公告)日：2004-07-06

申请号：US10328171

申请日：2002-12-26

申请人： Hideaki Yoshida ,  Tetsuya Ueda ,  Masashi Hamanaka ,  Takeshi Harada

发明人： Hideaki Yoshida ,  Tetsuya Ueda ,  Masashi Hamanaka ,  Takeshi Harada

IPC分类号： H01L214763

CPC分类号： H01L21/76832 ,  H01L21/02074 ,  H01L21/31053 ,  H01L21/31144 ,  H01L21/3212 ,  H01L21/76807 ,  H01L21/7684 ,  Y10S438/906 ,  Y10S438/952 ,  Y10S438/959

摘要： After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the wiring grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the wiring are removed by polishing. Thereafter, a foreign matter adhered to a surface to be polished during polishing is removed and then a surface of the anti-reflection film is polished.

摘要翻译： 在绝缘膜和绝缘膜上的抗反射膜中形成多个沟槽之后，在防反射膜上沉积阻挡金属膜和导电膜，使得每个布线槽被填充。 随后，通过研磨去除沟槽外部的导电膜的部分，然后通过抛光除去布线外部的阻挡金属膜的部分。 此后，除去在抛光期间附着于抛光表面的异物，然后抛光抗反射膜的表面。

公开(公告)号：US06737348B2

公开(公告)日：2004-05-18

申请号：US10120385

申请日：2002-04-12

申请人： Mitsunari Satake ,  Masashi Hamanaka ,  Hideaki Yoshida

发明人： Mitsunari Satake ,  Masashi Hamanaka ,  Hideaki Yoshida

IPC分类号： H01L21461

CPC分类号： H01L21/7684 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819

摘要： Holes are formed in a first insulating film deposited on a substrate. After depositing a first conducting film over the first insulating film including the holes, the first conducting film is subjected to first CMP, so as to form plugs from the first conducting film. Next, the first insulating film is subjected to second CMP with a polishing rate of the first insulating film higher than a polishing rate of the first conducting film, so as to planarize the first insulating film by eliminating erosion caused in a region of the first insulating film where the plugs are densely formed. After depositing a second insulating film on the planarized first insulating film, interconnect grooves are formed in the second insulating film. After depositing a second conducting film over the second insulating film including the interconnect grooves, the second conducting film is subjected to third CMP, so as to form buried interconnects from the second conducting film.

摘要翻译： 在沉积在基板上的第一绝缘膜中形成孔。 在包括孔的第一绝缘膜上沉积第一导电膜之后，对第一导电膜进行第一CMP，以形成来自第一导电膜的插塞。 接下来，对第一绝缘膜进行第二CMP，其中第一绝缘膜的抛光速率高于第一导电膜的抛光速率，以便通过消除在第一绝缘膜的区域中引起的侵蚀而使第一绝缘膜平坦化 胶片密集地形成。 在平坦化的第一绝缘膜上沉积第二绝缘膜之后，在第二绝缘膜中形成互连槽。 在包括互连槽的第二绝缘膜上沉积第二导电膜之后，对第二导电膜进行第三CMP，以形成来自第二导电膜的掩埋互连。

公开(公告)号：US06858549B2

公开(公告)日：2005-02-22

申请号：US10328178

申请日：2002-12-26

申请人： Masashi Hamanaka ,  Takeshi Harada ,  Hideaki Yoshida ,  Tetsuya Ueda

发明人： Masashi Hamanaka ,  Takeshi Harada ,  Hideaki Yoshida ,  Tetsuya Ueda

IPC分类号： H01L21/02 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L21/4763

CPC分类号： H01L21/76832 ,  H01L21/02074 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/7684 ,  Y10S438/906

摘要： After a plurality of grooves are formed in an insulating film and in an antireflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled. Subsequently, the portions of the conductive film outside the grooves are removed by a first polishing step and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, foreign matter adhered to the surface of the anti-reflection film is removed and a third polishing step is conducted on the surface of the anti-reflection film using an abrasive agent of the same type as used in the first polishing step of the conductive film.

摘要翻译： 在绝缘膜和绝缘膜上的防反射膜中形成多个沟槽之后，在抗反射膜上沉积阻挡金属膜和导电膜，使得每个沟槽被填充。 随后，通过第一抛光步骤去除沟槽外部的导电膜的部分，然后通过抛光去除凹槽外部的阻挡金属膜的部分。 此后，去除附着在防反射膜表面上的异物，并且使用与导电的第一抛光步骤中使用的相同类型的研磨剂在抗反射膜的表面上进行第三抛光步骤 电影。