Invention Grant
US06860723B2 Slurry flow control and monitor system for chemical mechanical polisher
失效
化学机械抛光机泥浆流量控制和监控系统
- Patent Title: Slurry flow control and monitor system for chemical mechanical polisher
- Patent Title (中): 化学机械抛光机泥浆流量控制和监控系统
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Application No.: US10264404Application Date: 2002-10-09
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Publication No.: US06860723B2Publication Date: 2005-03-01
- Inventor: Ben-Shu Chen , Chao-Jung Chang , Jui-Cheng Lo , Chin-Hsin Peng , Chien-Kuo Lu
- Applicant: Ben-Shu Chen , Chao-Jung Chang , Jui-Cheng Lo , Chin-Hsin Peng , Chien-Kuo Lu
- Applicant Address: TW Hsin Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee Address: TW Hsin Chu
- Agency: Tung & Associates
- Main IPC: F04B49/20
- IPC: F04B49/20 ; F04B49/00

Abstract:
A system for controlling and monitoring a rate of flow of a fluid, such as a CMP slurry, comprising a pump for pumping the slurry; a flow meter for monitoring the rate of flow of the slurry; and a controller operably connected to the flow meter and the pump. The controller receives signals from the flow meter indicating the rate of flow of the slurry and controls the operational speed of the pump responsive to the flow meter signals. A degasser equipped with a level sensor may be further provided in the system for removing gas bubbles from the slurry.
Public/Granted literature
- US20040071555A1 Slurry flow control and monitor system for chemical mechanical polisher Public/Granted day:2004-04-15
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