发明授权
US06873030B2 Metal gate electrode using silicidation and method of formation thereof
有权
使用硅化物的金属栅电极及其形成方法
- 专利标题: Metal gate electrode using silicidation and method of formation thereof
- 专利标题(中): 使用硅化物的金属栅电极及其形成方法
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申请号: US10431008申请日: 2003-05-07
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公开(公告)号: US06873030B2公开(公告)日: 2005-03-29
- 发明人: Witold Maszara , Zoran Krivokapic
- 申请人: Witold Maszara , Zoran Krivokapic
- 申请人地址: US CA Sunnyvale
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: US CA Sunnyvale
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L21/285 ; H01L21/336 ; H01L29/423 ; H01L29/49 ; H01L29/78 ; H01L27/082 ; H01L29/76
摘要:
A semiconductor device is fabricated by providing a substrate, and providing a dielectric layer on the substrate. A polysilicon body is formed on the dielectric layer, and a metal layer is provided on the polysilicon body. A silicidation process is undertaken to silicidize substantially the entire polysilicon body to form a gate on the dielectric. In an alternative process, a cap layer is provided on the polysilicon body, which cap layer is removed prior to the silicidation process. The polysilicon body is doped with a chosen specie prior to the silicidation process, which dopant, during the silicidation process, is driven toward the dielectric layer to form a gate portion having a high concentration thereof adjacent the dielectric, the type and concentration of this specie being instrumental in determining the work function of the formed gate.
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