发明授权
- 专利标题： Under bump metallurgy for Lead-Tin bump over copper pad
- 专利标题（中）： 铅焊锡凸点焊接在铜焊盘上
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申请号： US10608407申请日： 2003-06-26
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公开(公告)号： US06878465B2公开(公告)日： 2005-04-12
- 发明人: Peter K. Moon , Zhiyong Ma , Madhav Datta
- 申请人： Peter K. Moon , Zhiyong Ma , Madhav Datta
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K1/20 ; C22C21/06 ; H01L21/60 ; H01L23/485 ; B32B15/02 ; B32B15/04 ; B32B15/20 ; H01C23/48
摘要：
The present invention describes a method including providing a component, the component having a bond pad; forming a passivation layer over the component; forming a via in the passivation layer to uncover the bond pad; and forming an under bump metallurgy (UBM) over the passivation layer, in the via, and over the bond pad, in which the UBM includes an alloy of Aluminum and Magnesium.The present invention also describes an under bump metallurgy (UBM) that includes a lower layer, the lower layer including an alloy of Aluminum and Magnesium; and an upper layer located over the lower layer.
公开/授权文献
- US20040060970A1 Under bump metallurgy for Lead-Tin bump over copper pad 公开/授权日：2004-04-01
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