Invention Grant
- Patent Title: SOI semiconductor device
- Patent Title (中): SOI半导体器件
-
Application No.: US10791764Application Date: 2004-03-04
-
Publication No.: US06885067B2Publication Date: 2005-04-26
- Inventor: Takasumi Ohyanagi , Atsuo Watanabe
- Applicant: Takasumi Ohyanagi , Atsuo Watanabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP
- Priority: JP2001-318969 20011017
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L21/336 ; H01L21/762 ; H01L21/77 ; H01L21/8222 ; H01L21/8248 ; H01L21/8249 ; H01L21/84 ; H01L27/06 ; H01L27/08 ; H01L27/12 ; H01L29/08 ; H01L29/10 ; H01L29/73 ; H01L29/78 ; H01L29/786 ; H04M3/00 ; H04M3/18 ; H01L27/01

Abstract:
A power IC for an automobile engine control unit incorporating at least one semiconductor device comprising an N-channel insulated-gate filed-effect transistor formed on an SOI substrate, having an N-type layer having a concentration higher than a concentration of an N-type layer in contact with a p-body layer contacting a gate oxide film of the transistor. The high concentration N-type layer is formed in a region covering at most 95% of the source-drain distance between the p-body layer and a drain electrode of the transistor in the silicon substrate over an interface of a buried oxide film, the silicon substrate being in contact with both the field oxide film and the high concentration N-type layer contacting the drain electrode.
Public/Granted literature
- US20040169251A1 Semiconductor device and manufacturing method therefor Public/Granted day:2004-09-02
Information query
IPC分类: