发明授权
- 专利标题: Cooling device and cooling method
- 专利标题(中): 冷却装置及冷却方式
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申请号: US09800585申请日: 2001-03-08
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公开(公告)号: US06889764B2公开(公告)日: 2005-05-10
- 发明人: Tetsuya Sada , Osamu Hirose , Kiyohisa Tateyama
- 申请人: Tetsuya Sada , Osamu Hirose , Kiyohisa Tateyama
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP7-024743 19950119; JP8-24636 19960117
- 主分类号: H01L21/304
- IPC分类号: H01L21/304 ; G05D23/00 ; G05D23/19 ; H01L21/00 ; F25B29/00
摘要:
A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.
公开/授权文献
- US20010017035A1 Cooling device and cooling method 公开/授权日:2001-08-30
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