公开(公告)号：US5941083A

公开(公告)日：1999-08-24

申请号：US588309

申请日：1996-01-18

申请人： Tetsuya Sada ,  Osamu Hirose ,  Kiyohisa Tateyama

发明人： Tetsuya Sada ,  Osamu Hirose ,  Kiyohisa Tateyama

IPC分类号： H01L21/304 ,  G05D23/00 ,  G05D23/19 ,  H01L21/00 ,  F25B29/00

CPC分类号： H01L21/67109 ,  G05D23/1919

摘要： A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

摘要翻译： 用于将待处理物体冷却到目标温度的冷却装置包括安装在放置台上的多个接触构件，用于支撑物体，使得物体间隔着与放置台的顶面相对，用于输出的温度传感器 由接触构件支撑的物体的温度信息，用于将放置台冷却到低于目标温度的温度以冷却物体的第一冷却单元，用于将由第一冷却单元冷却的物体加热到第二冷却单元的温度 几乎等于目标温度;以及对比度电路，用于根据来自温度传感器的温度信息，通过第一冷却单元的冷却和由第二冷却单元进行加热之间进行切换操作。

公开(公告)号：US06216475B1

公开(公告)日：2001-04-17

申请号：US09358459

申请日：1999-07-22

申请人： Tetsuya Sada ,  Osamu Hirose ,  Kiyohisa Tateyama

发明人： Tetsuya Sada ,  Osamu Hirose ,  Kiyohisa Tateyama

IPC分类号： F25B2900

CPC分类号： H01L21/67109 ,  G05D23/1919

摘要： A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

摘要翻译： 用于将待处理物体冷却到目标温度的冷却装置包括安装在放置台上的多个接触构件，用于支撑物体，使得物体间隔着与放置台的顶面相对，用于输出的温度传感器 由接触构件支撑的物体的温度信息，用于将放置台冷却到低于目标温度的温度以冷却物体的第一冷却单元，用于将由第一冷却单元冷却的物体加热到第二冷却单元的温度 几乎等于目标温度;以及对比度电路，用于根据来自温度传感器的温度信息，通过第一冷却单元的冷却和由第二冷却单元进行加热之间进行切换操作。

公开(公告)号：US06889764B2

公开(公告)日：2005-05-10

申请号：US09800585

申请日：2001-03-08

申请人： Tetsuya Sada ,  Osamu Hirose ,  Kiyohisa Tateyama

发明人： Tetsuya Sada ,  Osamu Hirose ,  Kiyohisa Tateyama

IPC分类号： H01L21/304 ,  G05D23/00 ,  G05D23/19 ,  H01L21/00 ,  F25B29/00

CPC分类号： H01L21/67109 ,  G05D23/1919

摘要： A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

摘要翻译： 用于将待处理物体冷却到目标温度的冷却装置包括安装在放置台上的多个接触构件，用于支撑物体，使得物体间隔着与放置台的顶面相对，用于输出的温度传感器 由接触构件支撑的物体的温度信息，用于将放置台冷却到低于目标温度的温度以冷却物体的第一冷却单元，用于将由第一冷却单元冷却的物体加热到第二冷却单元的温度 几乎等于目标温度;以及对比度电路，用于根据来自温度传感器的温度信息，通过第一冷却单元的冷却和由第二冷却单元进行加热之间进行切换操作。

公开(公告)号：US6159288A

公开(公告)日：2000-12-12

申请号：US935917

申请日：1997-09-23

申请人： Fumio Satou ,  Mitsuhiro Sakai ,  Takeshi Tsukamoto ,  Yoichi Honda ,  Kiyomitsu Yamaguchi ,  Kimio Motoda ,  Yoshitaka Matsuda ,  Tetsuya Sada ,  Kiyohisa Tateyama

发明人： Fumio Satou ,  Mitsuhiro Sakai ,  Takeshi Tsukamoto ,  Yoichi Honda ,  Kiyomitsu Yamaguchi ,  Kimio Motoda ,  Yoshitaka Matsuda ,  Tetsuya Sada ,  Kiyohisa Tateyama

IPC分类号： B05C11/08 ,  B05C9/06 ,  B05C11/00

CPC分类号： B05C11/08 ,  Y10S134/902

摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

公开(公告)号：US06391110B1

公开(公告)日：2002-05-21

申请号：US09686820

申请日：2000-10-12

申请人： Fumio Satou ,  Mitsuhiro Sakai ,  Takeshi Tsukamoto ,  Yoichi Honda ,  Kiyomitsu Yamaguchi ,  Tetsuya Sada ,  Kiyohisa Tateyama

发明人： Fumio Satou ,  Mitsuhiro Sakai ,  Takeshi Tsukamoto ,  Yoichi Honda ,  Kiyomitsu Yamaguchi ,  Tetsuya Sada ,  Kiyohisa Tateyama

IPC分类号： B05C1100

CPC分类号： B05C11/08 ,  Y10S134/902

摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

摘要翻译： 提供了一种处理装置，该装置包括：用于回收在处理物体时流出或飞出的处理液的容器;清洗装置，用于通过向容器供给清洗液体来清洗容器的内壁表面;以及 循环系统，用于当通过清洁装置清洁容器的内壁表面并将回收的液体供应到清洁装置时，回收从容器排出的排出液体。

公开(公告)号：US6002572A

公开(公告)日：1999-12-14

申请号：US46536

申请日：1998-03-24

申请人： Osamu Hirose ,  Tetsuya Sada

发明人： Osamu Hirose ,  Tetsuya Sada

IPC分类号： H01L21/00 ,  H05F3/06

CPC分类号： H01L21/67017

摘要： The processing apparatus prevents difficulty in separation of the substrate from the base because of charges on the substrate when the substrate is lifted from the base for substrate placing during processing. The processing apparatus comprises pins to lift up the substrate on the base and a neutralization apparatus to discharge ionized gas to the gap between the bottom of the substrate lifted from the base by the pins and the top of the base. When ionized gas is discharged to the substrate and the base, the charges are neutralized.

摘要翻译： 当处理期间当基板从用于基板放置的基座抬起时，由于基板上的电荷，处理装置防止基板与基板分离的困难。 处理装置包括用于提升基座上的基板的引脚和中和装置，用于将离子化气体排放到基板的底部之间通过销和基座的顶部提升的基板的底部之间的间隙。 当离子化气体被排放到基底和基底时，电荷被中和。

公开(公告)号：US06456480B1

公开(公告)日：2002-09-24

申请号：US09371842

申请日：1999-08-11

申请人： Osamu Hirose ,  Tetsuya Sada

发明人： Osamu Hirose ,  Tetsuya Sada

IPC分类号： H05F306

CPC分类号： H01L21/67017

摘要： The processing apparatus prevents difficulty in separation of the substrate from the base because of charges on the substrate when the substrate is lifted from the base for substrate placing during processing. The processing apparatus comprises pins to lift up the substrate on the base and a neutralization apparatus to discharge ionized gas to the gap between the bottom of the substrate lifted from the base by the pins and the top of the base. When ionized gas is discharged to the substrate and the base, the charges are neutralized. In addition, the processing apparatus comprises three or more of proximity pins, which form gap between the bottom of the substrate on the base and the top of the base to prevent a frictional electricity being formed therein.

摘要翻译： 当处理期间当基板从用于基板放置的基座抬起时，由于基板上的电荷，处理装置防止基板与基板分离的困难。 处理装置包括用于提升基座上的基板的引脚和中和装置，用于将离子化气体排放到基板的底部之间通过销和基座的顶部提升的基板的底部之间的间隙。 当离子化气体被排放到基底和基底时，电荷被中和。 此外，处理装置包括三个或更多个接近销，其在基座的底部的底部和底部的顶部之间形成间隙，以防止在其中形成摩擦电。

公开(公告)号：US6129546A

公开(公告)日：2000-10-10

申请号：US338231

申请日：1999-06-22

申请人： Tetsuya Sada

发明人： Tetsuya Sada

IPC分类号： G02F1/13 ,  F27D5/00 ,  H01L21/027 ,  H01L21/30 ,  H01L21/68 ,  H01L21/683

CPC分类号： H01L21/68742 ,  H01L21/67109 ,  H01L21/6838 ,  H01L21/6875

摘要： Pins that are small protrusions are disposed on the upper surface of a heat process board. Through-holes are formed between the pins so as to deaerate from a space thereof. In a predetermined time period in the initial stage of the heat process, a deaerating process is performed using the through-holes. Thus, a negative pressure is applied to the space between the lower surface of the substrate and the upper surface of the heat process board so as to contact the substrate and the heat process board. Thereafter, the vacuum degree is lowered. Due to the rigidity of the substrate, the substrate and the heat process board are separated. In the initial stage of the heat process, since the substrate and the heat process board directly contact, the temperature of the substrate quickly and equally rises. In addition, when the heat shrinkage is large, since the substrate and the heat process board are separated, static electricity due to friction hardly takes place. Thus, a static breakdown can be prevented. Consequently, a heat process apparatus and a heat process method that allow the entire substrate to be heat-processed are provided.

摘要翻译： 作为小突起的销设置在加热板的上表面上。 在销之间形成通孔，以便从其空间脱气。 在热处理的初始阶段的预定时间段中，使用通孔进行脱气处理。 因此，对基板的下表面和加热板的上表面之间的空间施加负压，以接触基板和加热板。 此后，真空度降低。 由于基板的刚性，衬底和加热板被分离。 在热处理的初始阶段，由于基板和加热板直接接触，基板的温度快速均匀地上升。 此外，当热收缩率大时，由于基板和加热板分离，所以几乎不发生由于摩擦而产生的静电。 因此，可以防止静电击穿。 因此，提供允许整个基板被热处理的热处理装置和热处理方法。

公开(公告)号：US6062240A

公开(公告)日：2000-05-16

申请号：US35902

申请日：1998-03-06

申请人： Tetsuya Sada ,  Norio Uchihira ,  Mitsuhiro Sakai ,  Kiyomitsu Yamaguchi

发明人： Tetsuya Sada ,  Norio Uchihira ,  Mitsuhiro Sakai ,  Kiyomitsu Yamaguchi

IPC分类号： B05C11/08 ,  G03F7/16 ,  H01L21/00 ,  H01L21/687 ,  B08B3/02

CPC分类号： H01L21/6715 ,  B05C11/08 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/68714 ,  Y10S134/902

摘要： A treatment device comprising a holding method for holding a substrate such as an LCD substrate; and a treatment solution supply method for supplying a treatment solution on a surface of the substrate wherein the holding method has a substrate-placing portion on which the substrate is disposed, the substrate-placing is made of a synthetic resinous material. Since the holding method has a substrate-placing portion which is made of a synthetic resinous material, the electric charge amount of the substrate can be reduced to prevent various static electricity caused troubles such as the electrostatic destruction of the device formed on the substrate. Further, a discharge noise trouble due to discharge phenomenon from the substrate to a transporting method can be prevented. Further, it is possible to reduce the electric charge amount of the holding method and destaticize the holding method by supplying a destaticizing fluid such as ionized pure water or ionized gas towards above or below the holding method. Thus, it is possible to prevent various static-electricity caused troubles such as the electrostatic destruction of the device formed in the device from occurring and further, possible to prevent noise troubles from occurring because the generation degree of the discharge which occurs between the substrate and the transport method can be reduced further. The electric charge amount of the substrate can be reduced by making the thickness (distance) of the substrate-placing portion formed of a dielectric thick (long).

摘要翻译： 一种处理装置，包括用于保持诸如LCD基板的基板的保持方法; 以及一种处理溶液供应方法，用于在基板的表面上提供处理溶液，其中保持方法具有其上设置有基板的基板放置部分，基板放置由合成树脂材料制成。 由于保持方法具有由合成树脂材料制成的基板放置部分，所以可以减少基板的电荷量，以防止各种静电引起诸如形成在基板上的装置的静电破坏的麻烦。 此外，可以防止由于从基板到输送方法的放电现象引起的放电噪声问题。 此外，通过向静电保持方法的上方或下方供给诸如电离纯化水或离子化气体的去静电液体，可以减少保持方法的电荷量并使其保持静电。 因此，可以防止各种静电引起的故障，例如装置中形成的装置的静电破坏的发生，并且进一步可以防止由于在基板和基板之间发生的放电的产生程度而发生噪声问题 可以进一步降低运输方式。 通过使电介质厚（长）形成的基板载置部的厚度（距离）可以减小基板的电荷量。

公开(公告)号：US06565656B2

公开(公告)日：2003-05-20

申请号：US09738814

申请日：2000-12-15

申请人： Tetsuya Sada ,  Hiroshi Hashimoto ,  Yuji Shimomura

发明人： Tetsuya Sada ,  Hiroshi Hashimoto ,  Yuji Shimomura

IPC分类号： B05C1106

CPC分类号： H01L21/6715 ,  B05C11/08

摘要： A coating processing apparatus is structured by a rotating cup having an opening portion on the top thereof for housing a substrate, a spin chuck for rotating the substrate in the rotating cup, a lid body having an opening and attached to the rotating cup, a resist solution discharge nozzle for discharging a resist solution onto the substrate through the opening of the lid body, a small lid for blocking up the opening of the lid body, and a protrusion member provided on the underneath surface of the small lid to be positioned inside the rotating cup when the small lid is attached into the opening of the lid body. Thus, adjustment of a film thickness of a coating film after a coating solution is coated can be effectively performed.

摘要翻译： 涂布处理装置由旋转杯构成，该旋转杯的顶部具有用于容纳基材的开口部分，用于使旋转杯中的基材旋转的旋转卡盘，具有开口并附接到旋转杯的盖体，抗蚀剂 溶液排出喷嘴，用于通过盖体的开口将抗蚀剂溶液排出到基板上，用于封闭盖体的开口的小盖以及设置在小盖的下表面上的突出构件， 当小盖子被安装到盖体的开口时，旋转杯子。 因此，可以有效地进行涂布涂布液之后的涂膜的膜厚的调整。