发明授权
- 专利标题： HDP-CVD uniformity control
- 专利标题（中）： HDP-CVD均匀性控制
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申请号： US10435296申请日： 2003-05-09
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公开(公告)号： US06890597B2公开(公告)日： 2005-05-10
- 发明人: Padmanabhan Krishnaraj , Bruno Geoffrion , Michael S. Cox , Lin Zhang , Bikram Kapoor , Anchuan Wang , Zhenjiang Cui
- 申请人： Padmanabhan Krishnaraj , Bruno Geoffrion , Michael S. Cox , Lin Zhang , Bikram Kapoor , Anchuan Wang , Zhenjiang Cui
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Townsend and Townsend and Crew
- 主分类号： C23C16/44
- IPC分类号： C23C16/44 ; C23C16/455 ; C23C16/56 ; C23C16/40
摘要：
A combination of deposition and polishing steps are used to permit improved uniformity of a film after the combination of steps. Both the deposition and polishing are performed with processes that vary across the substrate. The combination of the varying deposition and etching rates results in a film that is substantially planar after the film has been polished. In some instances, it may be easier to control the variation of one of the two processes than the other so that the more controllable process is tailored to accommodate nonuniformities introduced by the less controllable process.
公开/授权文献
- US20040224090A1 HDP-CVD uniformity control 公开/授权日：2004-11-11
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