发明授权
- 专利标题： Method of dividing a semiconductor wafer
- 专利标题（中）： 划分半导体晶片的方法
-
申请号： US10431816申请日： 2003-05-08
-
公开(公告)号： US06893943B2公开(公告)日： 2005-05-17
- 发明人: Takashi Ohsumi , Yuzo Kato
- 申请人： Takashi Ohsumi , Yuzo Kato
- 申请人地址： JP Tokyo
- 专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Volentine Francos & Whitt, PLLC
- 优先权： JP11-065160 19990311
- 主分类号： H01L21/301
- IPC分类号： H01L21/301 ; H01L21/60 ; H01L23/544
摘要：
A method for dividing a semiconductor wafer which is covered by an opaque resin in a dicing process includes forming marks on the semiconductor wafer, wherein the marks are distinguished from electrodes which are formed on the semiconductor wafer. According to the method, in a dicing process, separating semiconductor chips from the semiconductor wafer can be precisely achieved.
公开/授权文献
信息查询
IPC分类:
