Abstract:
A mask ROM small in circuit scale and low in consumption power has an n-type select transistor having a drain connected to a corresponding one of bit lines, a source connected to a data line, and a gate having a corresponding one of select signals input thereto. A p-type precharge transistor has a drain connected to a corresponding one of bit lines, a source connected to a power line, and a gate having a corresponding one of the select signals input thereto. Because the bit line is precharged by using a precharge transistor opposite in conductivity type to the select transistors, it is satisfactory to provide one precharge transistor for one bit line, greatly reducing the circuit scale.
Abstract:
An adhesion layer for causing a plug for electrically connecting a lower wiring and an upper wiring opposite to each other with an interlayer insulating film interposed therebetween to adhere to the interlayer insulating film is formed within a through hole for forming the plug, based on a predetermined aspect ratio represented by a ratio of a depth dimension of the through hole to a diameter dimension of the through hole.
Abstract:
An operational amplifier including a differential input section generating a first signal as a differential voltage between two input signals; an amplifying section amplifying the first signal into second and third complementary signals; a first MOS transistor between a first supply voltage and an output node, a conduction state of the first MOS transistor controlled responsive to the second signal; a second MOS transistor between a second supply voltage and the output node, a conduction state of the second MOS transistor controlled responsive to the third signal; and a step-up section stepping up the first and second supply voltages to generate a step-up voltage higher than the first and second supply voltages, the amplifying section driven by the step-up voltage so that an absolute value of the maximum level of the second or third signal becomes larger than the absolute value of the first or second supply voltage.
Abstract:
A management system and method of a reticle in an exposing process are disclosed. A calculator calculates an accumulated dosage of an illuminating light irradiated onto a reticle used in a photolithography process. The calculator is connected to an exposing apparatus to expose photoresist on a semiconductor substrate. A comparator compares the calculated accumulated dosage with a preset reference dosage. When the calculated accumulated dosage is greater than or equal to the reference dosage, a controller suspends the photolithography process. Minimizing haze contamination on the reticle, thus preventing process failures.
Abstract:
The present application discloses a method of cleaning a semiconductor wafer by mounting a wafer to a chuck, positioning a gas guard, defining therein a chamber having an open bottom, immediately above the layer of water, spraying de-ionized water onto the wafer while rotating the chuck at a location outside the chamber when the wafer is mounted to the chuck, to thereby form a layer of water on the wafer, and spraying a cleaning gas from a gas spraying unit disposed above said chuck through the chamber and into the layer of water to thereby cause the cleaning gas to dissolve in the layer of water, and at the same time moving the chamber across a surface of the wafer, to thereby clean the wafer, wherein said gas spraying unit includes a gas injection tube oriented to inject the cleaning gas towards the wafer mounted to the chuck, and the gas guard connected to the gas injection tube.
Abstract:
The present invention discloses a portable blackbody furnace comprising a metallic body, a cylindrical cavity with a tapered end in the metallic body, a shielding plate positioned at an open end of the cylindrical cavity, at least a first heaters positioned in the shielding plate, a plurality of second heaters positioned around the metallic body, and a plurality of thermometers positioned in the metallic body. Preferably, the heat capacity of the metallic body is larger than 200 Joules/K, and has radial thickness larger than 5 mm. There are grooves formed on the outer wall of the metallic body, and the second heaters are heating wires embedded inside the grooves. In addition, the flow direction of the current between two adjacent heating wires is opposite to eliminate the magnetic field generated from the current flow.
Abstract:
To reduce a current loss through a channel and improve electron mobility, a first semiconductor layer and a second semiconductor layer (sequentially formed on a semiconductor substrate) have different lattice properties. The first semiconductor layer and the second semiconductor layer may be etched to form a first semiconductor pattern. A third semiconductor layer having a lattice property substantially identical to that of the first semiconductor layer may be formed over the first semiconductor pattern. The third semiconductor layer may then be etched to form a second semiconductor pattern. A gate may be formed on the second semiconductor pattern. The contact surface between the second semiconductor pattern and the gate pattern may consequently increased to reduce a current loss. Further, the lattice properties may be changed to improve electron mobility of the semiconductor layers.
Abstract:
An analog circuit includes a pair of peak-hold circuits that generate peak signals indicating the peak values of a differential pair of input signals, a first differencing circuit such as a transconductance amplifier that takes the difference between the input signal values, a second differencing circuit such as a transconductance amplifier that takes the difference between the two peak signal values, and a combining circuit such as a resistor circuit that additively combines the outputs of the differencing circuits in such a way as to compensate for direct-current offset in the input signals. Advantages of this circuit structure include reduced power consumption and simplified implementation in an integrated circuit. Low pass filters, capacitor discharging circuits, and unbalanced circuit elements can be used to obtain further advantages.
Abstract:
CVD is performed without damaging a micro-fabricated semiconductor element. An organic material gas containing amine is used as deposition material gas. The material gas is introduced into a vacuum chamber and ultraviolet light radiated from each of lamps is applied onto an object to be processed that is placed in the chamber, thereby causing chemical vapor deposition to be carried out, whereby a film is grown at a temperature such that no damage is given to a semiconductor element or the like of the object.
Abstract:
A method of manufacturing a floating gate provides an enhancement for the efficiencies of electron charge and injection. First, a conductive pattern, constituting the floating gate is formed on a substrate. A first insulation layer is formed on a sidewall of the conductive pattern, and then a second insulation layer is formed at an upper portion of the conductive pattern in ways that increase the sharpness of an edge portion where the sidewall and upper portions of the conductive pattern meet. Therefore, electron transference from the floating ate to a control gate is facilitated.