发明授权
- 专利标题: Laser beam machining apparatus
- 专利标题(中): 激光束加工设备
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申请号: US10483954申请日: 2003-05-20
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公开(公告)号: US06894248B2公开(公告)日: 2005-05-17
- 发明人: Yoshifumi Arakawa , Shigeru Yokoi
- 申请人: Yoshifumi Arakawa , Shigeru Yokoi
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 国际申请: PCTJP03/06288 WO 20030520
- 国际公布: WO2004103 WO 20041202
- 主分类号: B23K26/03
- IPC分类号: B23K26/03 ; B23K26/14 ; B23K26/42 ; H01S3/02 ; B23K26/00 ; B23K26/12
摘要:
A laser beam machining apparatus includes a laser oscillator, a machining head which that machines a workpiece using the laser beam. An optical duct has an optical system to guide the laser beam from the laser oscillator to the machining head. Purge gas is supplied into the optical duct from a purge gas supply port, and the purge gas is output from a purge gas exhaust port. A detector detects presence of undesired gas in the optical duct.
公开/授权文献
- US20050061778A1 LASER BEAM MACHINING APPARATUS 公开/授权日:2005-03-24
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